Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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2024-03-21 Microvias | Blind Vias PCB Manufacturing
2024-03-21 Embedded Slot PCB Manufacturing
2024-03-20 Multi Cavity PCB Manufacturing
2024-03-20 Micro Via PCB Manufacturing
2024-03-20 Embedded Components PCB Manufacturing
2024-03-19 Micro Cavity PCB Supplier
2024-03-19 BT Epoxy Resin PCB Manufacturing
2024-03-19 Micro Cavity Substrates Manufacturing
2024-03-18 Bt Laminate PCB Manufacturing
2024-03-18 Cavity Substrate Manufacturing
2024-03-18 Low CET PCB Manufacturing
2024-03-17 Ultrathin BT PCB Manufacturing
2024-03-16 Bt Laminate Substrate Manufacturing
2024-03-15 Mini Led PCB Manufacturing
2024-03-14 Semiconductor Substrate Manufacturer
2024-03-13 Ceramic Packaging Substrate Manufacturer
2024-03-12 Rigid-Flex Packaging Substrate Manufacturer
2024-03-11 Rigid-Flex BGA Substrate Manufacturer
2024-03-08 Semiconductor BGA Substrate Manufacturer
2024-03-07 Semiconductor FC BGA Substrate Manufacturer

We have produced many 2 layer to 50 layer High-speed materials PCBs, High-speed Package substrate, High Frequency packaging substrate and other types High quality HDI substrates. the smallest(minimum) trace width are 9um, the minimum spacing are 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the High-speed/High Hrequency packaging substrate materials we used from USA, Japan,South Korea.The material quality of the substrate is very stable.