BT Materials for Chip Subtrate

BT Substrate Manufacturer.A pioneering force in the tech industry, the BT Substrate Manufacturer stands as a cornerstone of innovation. With precision and expertise, they craft substrates that underpin the very foundations of modern electronics. Their relentless commitment to quality ensures that each substrate embodies durability, conductivity, and efficiency. From cutting-edge semiconductors to advanced circuitry, their products enable the seamless operation of devices worldwide. Through meticulous research and development, they continuously push the boundaries of possibility, driving progress in telecommunications, computing, and beyond. In a landscape of constant evolution, they remain at the forefront, shaping the future of technology.

In the field of modern electronic manufacturing, BT (Bismaleimide Triazine) substrate has become an important part of packaging technology due to its excellent performance and multi-functional characteristics. BT substrate is a high-performance engineering plastic with excellent thermal stability, mechanical strength and electrical properties. The development history behind it is inseparable from the pursuit of more advanced packaging solutions.

BT substrates have emerged in response to these demands, offering expansive application possibilities for electronic devices.

In contemporary chip design and manufacturing, the significance of BT materials cannot be overstated. Firstly, they excel in high-density circuit routing, establishing dependable electrical connections to chips. Secondly, the outstanding stability of BT substrates in high-temperature environments positions them as an ideal choice for high-performance chips, particularly in applications demanding extensive data processing and frequent operations.

A key advantage of employing BT material lies in its exceptional thermal stability, enabling the maintenance of structural integrity and electrical performance in high-temperature settings. This attribute is crucial in the frequently elevated temperature conditions prevalent in modern electronic equipment, such as processors and servers. Consequently, the selection of BT materials in chip substrates is not merely to meet current technical requirements but is also a strategic response to the evolving challenges of the future electronics industry.

In summary, this article aims to delve into the background and significance of BT substrates in chip substrates, offering readers a comprehensive perspective on this pivotal packaging material.

Definition of BT substrate material

BT, Bismaleimide Triazine, is a high-performance material widely used in the field of packaging substrates. Understanding the nature of BT and its critical role in packaging substrates is critical to a deep understanding of modern electronics manufacturing.

The role of BT in packaging substrates is mainly reflected in its strong performance as a substrate material.

The BT substrate serves a dual function as both an electrical insulator and a mechanical support within the package. Its role extends beyond efficiently isolating circuits and minimizing signal interference; it also offers robust mechanical support, ensuring the stability of electronic components. Thanks to its low dielectric constant and minimal dielectric loss, BT finds extensive application in high-frequency and high-speed electronic devices, notably in communication systems and computer chips.

Describe the characteristics and advantages of BT substrate materials

BT substrate material has a range of excellent properties, making it an ideal choice for packaging substrates.

High temperature stability: BT substrate exhibits excellent high temperature stability, allowing it to maintain stable performance in extreme working environments. This is crucial for some electronic equipment that requires long-term high-load operation.

Excellent electrical properties: BT substrate has low dielectric constant and low dielectric loss, which effectively reduces energy loss in signal transmission and improves circuit performance.

Mechanical strength: BT substrate not only remains stable in high temperature environments, but also has excellent mechanical strength. This enables it to withstand the weight of electronic components and external stresses, ensuring the reliability of the entire system.

High-density wiring capability: Due to its excellent insulation properties, BT substrate can achieve high-density circuit wiring to meet the needs of modern electronic equipment for miniaturization and lightweight.

Overall, BT substrate materials occupy an important position in the field of packaging substrates with their excellent performance, providing solid support for the development of the electronics industry.

Copper Clad Lamminates	Prepregs	CCL Thickness	Prepreg Thickness
CCL-HL820WDI	－	0.04, 0.05, 0.06, 0.1-1.0(0.1step), 0.46	－

Typical properties of Materials

Item		Condition	Util	HL820WDl
Dielectric Constant	1MHz	A	－	－
	1GHz	A	－	5.7
Dissipation Factor	1MHz	A	－	－
	1GHz	A	－	0.020
Insulation Resistance		C-96/20/65	Oh	5×10¹³ˉ¹⁵
Surface Resistance		C-96/20/65	Oh	5×10¹³ˉ¹⁵
Volume Resistivity		C-96/20/65	Oh·cm	5×10¹⁴ˉ¹⁶
Flexural Strength	Warp	A	MPa	480
	Fill	A	MPa	470
Flexural Modulus	Warp	A	GPa	23
	Fill	A	GPa	22
Tensile Strength	Warp	A	MPa	290
	Fill	A	MPa	280
Young’s Modulus	Warp	A	GPa	25
	Fill	A	GPa	24
Glass Transition Temp	DMA	A	℃	210
	TMA	A	℃	180
Cofficent of Thermal Expansion	Warp, Fill	A	ppm/℃	15
	Z(a1, a2)	A	ppm/℃	45/180
Peel Strength	12m	A	KN/m	101
	18m	A	KN/m	1.1
Flame Resistance	UL94	E-168/70	－	HB

What is the function of BT substrate?

In the manufacturing of contemporary electronic products, BT substrate plays a vital role as the core of chip packaging. BT substrate is a material specifically designed to cope with the demanding performance and reliability requirements of today’s electronic products. Essentially, it is an epoxy resin substrate material based on “bisimide triazine” or BT resin. This material was chosen not by chance but for its unique thermal, electrical and mechanical properties, making it ideal for advanced electronic applications.

The functions of BT substrate in chip packaging are reflected in many aspects. First, it serves as the basis for electronic components and provides reliable mechanical support. Its strong mechanical properties enable the BT substrate to withstand physical pressure and vibration that may occur in various environments, ensuring that electronic equipment can still operate stably under harsh conditions.

Secondly, BT substrates perform excellently in thermal management. The choice of its material stems from the unique thermal conductivity of BT resin, which effectively dissipates heat and prevents the chip from overheating and causing performance degradation or damage. This is crucial for today’s trend of increasingly compact and high-performance electronic devices, ensuring that the equipment can maintain stability when operating under high loads.

In addition, the low dielectric constant of the BT substrate makes it an excellent insulator, helping to reduce signal attenuation during signal transmission and maintain signal integrity. This is particularly critical in modern high-frequency electronic applications, where even small signal distortions can degrade system performance.

Among the wide range of BT substrates, including standard BT, high-frequency BT and halogen-free BT substrates, each is customized according to specific performance requirements. This diversity makes BT substrates an ideal choice covering multiple industries such as telecommunications, automotive, and consumer electronics.

Overall, BT substrates stand out in modern electronic packaging for their superior performance and versatility. As an electronic engineer, in-depth understanding and full utilization of the advantages of BT substrate will provide strong support for the design and manufacturing of advanced electronic equipment and promote the continuous progress of science and technology.

What types of BT substrates are there?

BT substrate, as the backbone of the electronic packaging field, its diversified types show excellent performance and applicability in different fields. From standard BT to high-frequency BT to halogen-free BT substrates, each type is tailor-made under specific performance standards, providing an ideal choice for industries ranging from telecommunications to aerospace.

Standard BT substrate

Standard BT substrates are renowned for their rugged performance and wide applicability. Its BT resin-based composition gives it excellent thermal and electrical properties, making it a mainstream choice in electronic device manufacturing. In traditional electronic applications, standard BT substrates assume the important task of providing reliability and stability.

High frequency BT substrate

With the increase in high-frequency applications such as communications and radar, high-frequency BT substrates have emerged. Its special formula and material selection enable it to perform excellently in high-frequency environments. The low dielectric constant and low loss angle tangent value of high-frequency BT substrate make it the first choice in fields such as wireless communications and radio frequency equipment to ensure the stability and efficiency of signal transmission.

Halogen-free BT substrate

Amid growing apprehensions about environmental conservation and health and safety considerations, the emergence of halogen-free BT substrates is gaining momentum. Leveraging halogen-free additives, this substrate excels in high-temperature environments while alleviating environmental and health concerns associated with halogens. Particularly in industries like aerospace, where stringent material requirements prevail, halogen-free BT substrates have emerged as a conscientious and sustainable choice, aligning with green practices.

Wide application fields of BT substrate

The versatility of BT substrates makes them ideal across a wide range of industries. From telecommunications to aerospace, it provides tailor-made solutions for different application scenarios. In the field of telecommunications, standard BT substrates ensure the reliability and performance of communication equipment; in high-frequency BT substrates, wireless communication equipment can be easily solved; and halogen-free BT substrates play a key role in the aerospace field with extremely high environmental requirements. .

What is the difference between BT substrate and traditional PCB?

When delving into the differences between BT substrates and traditional PCBs, we are able to gain insight into the unique advantages of both in the field of electronic engineering. Going through the background of traditional PCB (including PWB and motherboard) as the backbone of electronic systems, we find that BT substrate stands out with its professional composition and advanced performance, providing new possibilities for the evolution of electronic equipment.

Differences in professional composition

While traditional PCBs typically use standard materials and processes, BT substrates stand out with their unique BT resin-based composition. The selection of BT resin gives the substrate excellent thermal properties, electrical properties and mechanical strength. This professional composition enables BT substrates to perform better when dealing with more complex, high-performance electronic systems.

Breakthroughs in Advanced Performance

The introduction of BT substrate marks a challenge to the performance limit. Compared with traditional PCB, BT substrate has achieved significant breakthroughs in thermal management, signal integrity and reliability.

Differences extend to emerging technologies

This difference not only stops between BT substrate and traditional PCB, it also affects the development of emerging technologies. In new technologies such as substrate style PCB (SLP) and high-density interconnect (HDI) substrates, the advanced performance of BT substrates makes them the engine driving the advancement of these technologies. The adoption of SLP technology makes electronic devices thinner and lighter, while HDI technology enables a more compact layout of electronic components, all thanks to the unique contribution of BT substrates.

Overall, BT substrates stand out in comparison with traditional PCBs through their professional composition and advanced performance, becoming a highlight in today’s electronic engineering field. This difference not only improves the overall performance of electronic systems, but also promotes the development of emerging technologies, laying a solid foundation for smaller, faster, and more reliable electronic devices in the future. In the era of pursuing technological innovation and high performance, understanding the differences between BT substrates and traditional PCBs will provide electronic engineers with a broader space for innovation.

What are the structure and production technology of BT substrate?

In the field of PCB engineering, the manufacturing process of BT substrate reveals a remarkable technological miracle. The manufacturing core of this critical component contains complex structures and advanced production technologies, providing industry-leading solutions for pushing the limits of miniaturization and performance.

The complex structure of BT substrate

The design of BT substrate is not just a simple physical support, but also a science. Its structure covers multiple levels to meet the needs of different electronic applications. In this structure, BT resin serves as the base material, and its high glass transition temperature and low dielectric constant make it an ideal insulating material. This provides solid mechanical support to the electronic components while ensuring high quality and reliability of signal transmission.

Progress in production technology

The manufacturing of BT substrates is inseparable from advanced production technologies, among which improved high-density interconnect manufacturing technology and semi-additive methods stand out.

Improved high-density interconnect manufacturing technology

The key to this technology is to achieve a tighter layout between components, resulting in smaller overall size and better performance. Through a micro-manufacturing process, high-density interconnection technology not only tightly integrates components, but also achieves a high degree of controllability of signals through precise circuit layout and layered structures.

Semi-additive method

The semi-additive approach reduces waste and environmental impact by building circuits layer by layer. This method reduces resource waste in the production process while improving production efficiency. The adoption of the semi-additive method demonstrates the industry’s commitment to sustainability and its focus on environmental protection while pursuing miniaturization.

The push for miniaturization and performance extremes

The manufacturing of BT substrates is not only about pursuing miniaturization, but also about pushing the limits of performance. The combination of high-density interconnect technology and semi-additive methods allows electronic components to be more closely packed, thereby improving overall performance. This driving force is the source of power for BT substrates to achieve breakthroughs in the electronics industry.

In this dynamic and competitive field, the complex structure and advanced production technology of BT substrates have become key factors for companies to gain competitive advantage. With the continuous advancement of technology, we are expected to witness BT substrates playing a more important role in future electronic products, bringing more advanced and efficient solutions to our digital life.

FAQ: Revealing the secret of BT substrate?

Before we dive into the BT substrate, let’s demystify it and answer some key questions to better understand the role of this key component in PCB engineering.

How is BT substrate different from traditional PCB?

There are significant differences in materials and performance between BT substrate and traditional PCB. Traditional PCBs usually use standard fiberglass substrates, while BT substrates use special materials based on BT resin. This material selection gives BT substrates excellent thermal stability, electrical properties and mechanical strength, making them the first choice for high-performance electronic applications.

What are the unique features of BT substrate?

BT substrates play a key role in the layout of electronic components, not only providing mechanical support but also effectively managing heat. Its high glass transition temperature and low dielectric constant ensure minimal signal loss and improve signal integrity. This unique property allows BT substrates to perform well in a variety of environments and applications.

What are the structure and manufacturing technology of BT substrate?

The structure of the BT substrate is complex and precise, using improved high-density interconnection manufacturing technology and semi-additive methods. These technologies drive the process of miniaturization and performance upgrades, providing more efficient solutions for modern electronic devices.

How does BT substrate enhance thermal management?

BT substrate has unique thermal conductivity and can conduct and dissipate heat efficiently. This property is critical to the longevity and reliability of electronic components, making BT substrates ideal for electronic systems operating in high-temperature environments.

Which industries can benefit most from BT substrate technology?

Owing to its outstanding performance, BT substrates find extensive applications across diverse industries, including telecommunications, automotive, and consumer electronics. Its versatile utility positions it as a key player in various fields, underscoring its significant role in facilitating technological advancements across these sectors.

What is the future development trend of BT substrates?

As electronic devices continue to evolve, BT substrates will continue to play a key role. Future development trends include more advanced manufacturing technologies, higher-performance materials, and wider application fields, which will provide electronic engineers with more innovative possibilities.

By revealing these aspects of BT substrate, we gain a deeper understanding of its unique position in PCB engineering. This deep understanding provides valuable insights into the design and manufacture of advanced electronic devices, helping to advance electronic technology.