Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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Radio Frequency PCB Manufacturer

2024-05-09 Company News / News / Notification / Trade News

Radio Frequency PCB Manufacturer.A Radio Frequency PCB Manufacturer specializes in designing and producing printed circuit boards (PCBs) tailored for radio frequency (RF) applications. These manufacturers ensure that PCBs can handle high-frequency signals with minimal interference and signal loss, crucial for devices like wireless communications, radar systems, and satellite technology. They…

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CPU substrates Manufacturer

2024-05-09 Company News / News / Notification / Trade News

CPU substrates Manufacturer.A CPU substrates manufacturer specializes in producing high-quality substrates for central processing units (CPUs). These substrates, essential for mounting and interconnecting semiconductor devices, ensure optimal electrical performance and thermal management. By leveraging advanced materials and precision engineering, the manufacturer supports the development of powerful, efficient, and reliable computing…

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FC-LGA Substrates Manufacturer

2024-05-08 Company News / News / Notification / Trade News

FC-LGA Substrates Manufacturer.FC-LGA Substrates Manufacturer specializes in producing high-performance flip-chip land grid array (FC-LGA) substrates, essential components in modern semiconductor packaging. These substrates provide reliable electrical connections and thermal management for integrated circuits, enhancing performance and durability in electronic devices. The manufacturer employs advanced technologies and strict quality control to…

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Ultrathin IC Package Substrates Manufacturer

2024-05-08 Company News / News / Notification / Trade News

Ultrathin IC Package Substrates Manufacturer.The company is a leading Ultrathin IC Package Substrates Manufacturer, specializing in the production of high-precision, ultra-thin integrated circuit (IC) package substrates. With advanced technology and state-of-the-art facilities, they deliver exceptional quality products designed for high-performance electronics, ensuring optimal functionality and reliability for cutting-edge applications in…

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Ultrathin CPU Package Substrates Manufacturer

2024-05-07 Company News / News / Notification / Trade News

What is Ultrathin CPU Package Substrates? Ultrathin CPU Package Substrates Manufacturer.Specializing in cutting-edge technology, our company is at the forefront of producing ultrathin CPU package substrates. With precision engineering and advanced materials, we craft substrates that redefine performance standards in the industry. Our expertise lies in creating ultra-slim yet robust…

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AI Processor Substrates Manufacturer

2024-05-07 Company News / News / Notification / Trade News

AI Processor Substrates Manufacturer.An AI Processor Substrates Manufacturer specializes in crafting the fundamental architecture for cutting-edge artificial intelligence processors. Their expertise lies in meticulously engineering substrates that serve as the backbone for AI processing units, enabling seamless integration and optimal performance in advanced computing systems. With a keen focus on…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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market@alcantapcb.com

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