Fabricante profissional de substratos de embalagem e PCBs HDI de traço ultrapequeno.

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High Speed Mixed Dielectric PCB Manufacturing

2024-04-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

High Speed Mixed Dielectric PCB Manufacturing.High Speed Mixed Dielectric PCB Manufacturing involves the production of printed circuit boards using multiple dielectric materials to optimize electrical performance. This process is crucial for high-frequency applications, ensuring signal integrity and minimizing losses. Advanced techniques and materials are utilized to achieve superior speed and…

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Multi-Cavity PCB | RF PCB Manufacturing

2024-04-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Multi-Cavity PCB | RF PCB Manufacturing.Aluminum Nitride PCB Manufacturing involves the production of printed circuit boards (PCBs) usando nitreto de alumínio como material de substrato. Este processo é altamente valorizado em indústrias que exigem excelente condutividade térmica e isolamento elétrico. Os PCBs resultantes são ideais para dispositivos eletrônicos de alta potência, ensuring efficient heat…

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Extra Small Pitch PCB Manufacturing

2024-03-29 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Extra Small Pitch PCB Manufacturing.Extra Small Pitch PCB Manufacturing refers to the production process of printed circuit boards (PCBs) with very fine spacing between the electrical conductors. This technique is crucial for modern electronics, allowing for the creation of highly compact and complex devices. Precision and advanced technology are essential…

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Aluminum Nitride PCB (AlN PCB) Manufacturing

2024-03-29 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Aluminum Nitride PCB (AlN PCB) Manufacturing.Aluminum Nitride PCB (AlN PCB) manufacturing involves the production of high-performance circuit boards using aluminum nitride as the substrate material. Known for its excellent thermal conductivity and electrical insulation properties, AlN is ideal for applications requiring efficient heat dissipation and high reliability. The manufacturing process…

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Mixed Dielectric Rogers PCB Manufacturing

2024-03-28 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Mixed Dielectric Rogers PCB Manufacturing.Mixed Dielectric Rogers PCB Manufacturing involves the production of printed circuit boards using various dielectric materials from Rogers Corporation. This process enhances performance by integrating materials with different dielectric constants, resulting in improved signal integrity, reduced loss, and better thermal management. Ideal for high-frequency applications, this…

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Cavity PCB Technology Manufacturing

2024-03-28 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Cavity PCB Technology Manufacturing.Cavity PCB Technology Manufacturing involves the creation of printed circuit boards with cavities or recesses that allow for the integration of various components at different heights. This advanced technique enhances performance by minimizing signal loss and optimizing thermal management, making it ideal for high-frequency and power electronics…

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Nossos principais tipos de produtos, PCB ultrafino, traço ultrapequeno, Passo ultrapequeno, nós podemos produzir 2 camadas para 100 camadas de placa de circuito HDI de alta frequência / alta velocidade, nós podemos igualmente produzir 2 camadas para 20 camadas de substrato de pacote BGA de alta frequência / alta velocidade, O tempo de entrega da placa de circuito convencional de alta frequência / alta velocidade é de cerca de 1 Para 3 Semanas. O tempo de entrega do substrato de pacote BGA de alta frequência / alta velocidade, por exemplo: o prazo de entrega do traço ultrapequeno de 20 camadas (20um/20um) O substrato do pacote ABF FC BGA é de cerca de 3 Meses

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