Fabricante profissional de substratos de embalagem e PCBs HDI de traço ultrapequeno.

+086 0755 8524 1496 : market@alcantapcb.com |

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Ultra-Multilayer FC-LGA Substrates Manufacturer

2024-06-25 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ultra-Multilayer FC-LGA Substrates Manufacturer.As a leading RF SIP (System-in-Package) substrate manufacturer, we specialize in producing high-performance substrates for advanced RF applications. Our expertise ensures superior signal integrity, miniaturization, and thermal management, meeting the demands of modern wireless communication, IoT, and 5G technologies. Our state-of-the-art manufacturing processes and rigorous quality control…

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Flip Chip (ABF) Substrate Manufacturer

2024-06-24 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Flip Chip (ABF) Substrate Manufacturer.We specialize in the production of Flip Chip substrates using advanced ABF technology. Our expertise lies in crafting high-performance substrates that ensure robust interconnectivity and reliability for modern electronic devices. In the realm of modern electronics manufacturing, Flip Chip (ABF) Substrate plays an essential role. This…

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RF Package Substrates Manufacturer

2024-06-23 Notícias da empresa / Notícia / Notificação / Notícias comerciais

RF Package Substrates Manufacturer."RF Package Substrates Manufacturer" refers to a company specializing in the production of substrates tailored for RF (radio frequency) applications. They design and manufacture advanced materials and structures that optimize signal integrity, thermal management, and reliability in RF electronic devices. RF (Radio Frequency) package substrates are specialized…

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Ultra-Multilayer FC-BGA Package Substrates Manufacturer

2024-06-22 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Ultra-Multilayer FC-BGA Package Substrates Manufacturer.Manufacturer specializing in Ultra-Multilayer FC-BGA Package Substrates excels in producing advanced interconnection solutions for high-density electronic applications. Ultra-Multilayer FC-BGA Package Substrates play a crucial role in modern electronic technology. These substrates are key to the miniaturization and high performance of electronic devices, widely used in various…

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AI Accelerator Module Substrate Manufacturer

2024-06-21 Notícias da empresa / Notícia / Notificação / Notícias comerciais

AI Accelerator Module Substrate Manufacturer.AI Accelerator Module Substrate Manufacturer specializes in designing and producing advanced substrates for AI accelerator modules, ensuring optimal performance and efficiency in neural network processing. What is AI Accelerator Module Substrate? AI Accelerator Module Substrate is a key electronic component carrying platform, usually made of insulating…

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Substrate For Chips Manufacturer

2024-06-20 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Substrate For Chips Manufacturer."Substrate for Chips Manufacturer" refers to a specialized manufacturer that focuses on producing high-quality substrates used in chip packaging. They excel in designing and fabricating substrates tailored to meet the stringent requirements of modern semiconductor devices, ensuring optimal electrical performance and reliability. These manufacturers play a pivotal…

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Nossos principais tipos de produtos, PCB ultrafino, traço ultrapequeno, Passo ultrapequeno, nós podemos produzir 2 camadas para 100 camadas de placa de circuito HDI de alta frequência / alta velocidade, nós podemos igualmente produzir 2 camadas para 20 camadas de substrato de pacote BGA de alta frequência / alta velocidade, O tempo de entrega da placa de circuito convencional de alta frequência / alta velocidade é de cerca de 1 Para 3 Semanas. O tempo de entrega do substrato de pacote BGA de alta frequência / alta velocidade, por exemplo: o prazo de entrega do traço ultrapequeno de 20 camadas (20um/20um) O substrato do pacote ABF FC BGA é de cerca de 3 Meses

+086 0755 85241496

market@alcantapcb.com

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