Fabricante profissional de substratos de embalagem e PCBs HDI de traço ultrapequeno.

+086 0755 8524 1496 : market@alcantapcb.com |

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BGA Substrate Manufacturing

2024-01-23 Notícias da empresa / Notícia / Notificação / Notícias comerciais

BGA Substrate Manufacturing. From 2 camada para 20 layer IC/BGA substrates will be made with High speed and high frequency materials. Professional substrate production. Ball Grid Array (BGA) Substrate is an innovative packaging technology in electronic device design that strategically organizes spherical solder joints on the base plate to create…

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ABF Substrate Manufacturer

2024-01-22 Notícias da empresa / Notícia / Notificação / Notícias comerciais

ABF Substrate Manufacturer, ABF(Ajinomoto) and Showa Denko core materials. High multilayer and microtrace FCBGA, SIP, FCCSP package substrates will be made with this high quality core materials. We have a lot of these materials in stock. and We are a professional substrate company. ABF Substrate, also known as Ajinomoto Build-up…

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FCBGA Packaging Firm

2024-01-19 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCBGA Packaging Firm, Professional FCBGA packaging services, we mainly produce FCBGA, SIP, FCCSP, BGA/IC substrates, but we also focus on packaging services, we have a professional packaging (assembly) production lines. In this advanced packaging technology, FCBGA Packaging employs flip chip technology to invert the chip and affix it to the…

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FCBGA Package Manufacturer

2024-01-18 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCBGA Package Manufacturer.FCBGA Package Manufacturer specializes in crafting advanced packaging solutions for cutting-edge semiconductor devices. With a meticulous blend of precision engineering and innovative design, they cater to the demands of high-performance computing, telecommunications, and aerospace industries. Their expertise lies in the fabrication of Flip Chip Ball Grid Array (FCBGA)…

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FCBGA Substrates Manufacturer

2024-01-17 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCBGA Substrates Manufacturer, Professional FCBGA substrate production company, professional team and equipment, high-precision substrate production is inseparable from high-quality materials, so we use ABF substrate. This guest article will explore the distinctive features of FCBGA Substrates and shed light on their remarkable contributions to the field of electronic engineering. Functioning…

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FCBGA Packaging Substrate Manufacturer

2024-01-16 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCBGA Packaging Substrate Manufacturer, specializing in ultra-small trace width and pitch, We use the Showa Denko and ABF(Ajinomoto) core materials produce the FCBGA , SIP, FCCSP package substrates from 2 camada para 20 layers. FCBGA (Flip-Chip Ball Grid Array) Packaging Substrate emerges as a forefront technology in contemporary electronic engineering,…

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Nossos principais tipos de produtos, PCB ultrafino, traço ultrapequeno, Passo ultrapequeno, nós podemos produzir 2 camadas para 100 camadas de placa de circuito HDI de alta frequência / alta velocidade, nós podemos igualmente produzir 2 camadas para 20 camadas de substrato de pacote BGA de alta frequência / alta velocidade, O tempo de entrega da placa de circuito convencional de alta frequência / alta velocidade é de cerca de 1 Para 3 Semanas. O tempo de entrega do substrato de pacote BGA de alta frequência / alta velocidade, por exemplo: o prazo de entrega do traço ultrapequeno de 20 camadas (20um/20um) O substrato do pacote ABF FC BGA é de cerca de 3 Meses

+086 0755 85241496

market@alcantapcb.com

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