Fabricante profissional de substratos de embalagem e PCBs HDI de traço ultrapequeno.

+086 0755 8524 1496 : market@alcantapcb.com |

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BGA Cavity Substrate Manufacturer

2024-02-08 Notícias da empresa / Notícia / Notificação / Notícias comerciais

BGA Cavity Substrate Manufacturer, High speed and high frequency Cavity packaging substrate production. Open cavity(slot) on the PCB or BGA substrates. To do the Depth control slot on the base materials. BGA Cavity Substrate is an innovative Package Substrate. Its unique feature is that a groove (Cavity) is formed in…

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CSP package substrate Manufacturer

2024-02-07 Notícias da empresa / Notícia / Notificação / Notícias comerciais

CSP package substrate Manufacturer, High speed and high frequency CSP packaging substrate supplier, advanced Sap/Msap tech, fast delivery, stable quality. we offer CSP substrates from 2 camada para 20 layers. CSP Package Substrates are a key electronic component that are widely used in modern PCB (Printed Circuit Board, printed circuit…

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FCCSP Package Substrate Manufacturer

2024-02-06 Notícias da empresa / Notícia / Notificação / Notícias comerciais

FCCSP Package Substrate Manufacturer, BT base materials, ABF base materials, HF base materials FCCSP Package Substrate manufacturing from 4 camada para 20 layers. microtrace and microspacing. The BT FCCSP Package Substrate, an innovative circuit board in electronic engineering, combines advanced features like Ball Grid Array (BGA) and Chip Scale Package…

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Wire Bond Substrate Manufacturer

2024-02-05 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Wire Bond Substrate Manufacturer, BGA package substrates will be made with Wire Bonding. The best surface treatment process is ENEPIG. the Wire Bonding result will be more better than other surface treatment process. We will produce the surface treatment process according to your requirements. Wire Bond Substrate is a vital…

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Flip Chip CSP Package Substrate Manufacturer

2024-02-02 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Flip Chip CSP Package Substrate Manufacturer, Professional FCCSP /FCBGA/SIP Package Substrate production factory. I mainly produce high precision multilayer substrates from 4 camada para 20 layers. This reduces the length of wires compared to traditional packages, thereby enhancing the speed and stability of electrical signal transmission. Furthermore, this design allows…

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Chip Scale Package (CSP) Substrate Manufacturer

2024-02-01 Notícias da empresa / Notícia / Notificação / Notícias comerciais

Chip Scale Package (CSP) Substrate Manufacturer. FCCSP, FCBGA, SIP Package substrates manufacture from 4 camada para 20 layers. There are more than 20,000 employees. Chip Scale Package (CSP) substrate is an innovative packaging solution that holds significant importance in contemporary electronic devices. Its distinctive feature lies in its compact design,…

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Nossos principais tipos de produtos, PCB ultrafino, traço ultrapequeno, Passo ultrapequeno, nós podemos produzir 2 camadas para 100 camadas de placa de circuito HDI de alta frequência / alta velocidade, nós podemos igualmente produzir 2 camadas para 20 camadas de substrato de pacote BGA de alta frequência / alta velocidade, O tempo de entrega da placa de circuito convencional de alta frequência / alta velocidade é de cerca de 1 Para 3 Semanas. O tempo de entrega do substrato de pacote BGA de alta frequência / alta velocidade, por exemplo: o prazo de entrega do traço ultrapequeno de 20 camadas (20um/20um) O substrato do pacote ABF FC BGA é de cerca de 3 Meses

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market@alcantapcb.com

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