Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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IC Substrate Manufacturer

2024-01-24 Company News / News / Notification / Trade News

IC Substrate Manufacturer. Microtrace, Minimum spacing, and the best smallest vias holes are 50um(2mil), We specialize in producing high precision IC substrates from 2 layer to 20 layers. We use Mitsubishi BT materials, ABF(Ajinomoto) materials, or other high speed and high frequency materials. An IC substrate serves as a crucial…

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BGA Substrate Manufacturing

2024-01-23 Company News / News / Notification / Trade News

BGA Substrate Manufacturing. From 2 layer to 20 layer IC/BGA substrates will be made with High speed and high frequency materials. Professional substrate production. Ball Grid Array (BGA) Substrate is an innovative packaging technology in electronic device design that strategically organizes spherical solder joints on the base plate to create…

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ABF Substrate Manufacturer

2024-01-22 Company News / News / Notification / Trade News

ABF Substrate Manufacturer, ABF(Ajinomoto) and Showa Denko core materials. High multilayer and microtrace FCBGA, SIP, FCCSP package substrates will be made with this high quality core materials. We have a lot of these materials in stock. and We are a professional substrate company. ABF Substrate, also known as Ajinomoto Build-up…

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FCBGA Packaging Firm

2024-01-19 Company News / News / Notification / Trade News

FCBGA Packaging Firm, Professional FCBGA packaging services, we mainly produce FCBGA, SIP, FCCSP, BGA/IC substrates, but we also focus on packaging services, we have a professional packaging (assembly) production lines. In this advanced packaging technology, FCBGA Packaging employs flip chip technology to invert the chip and affix it to the…

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FCBGA Package Manufacturer

2024-01-18 Company News / News / Notification / Trade News

FCBGA Package Manufacturer.FCBGA Package Manufacturer specializes in crafting advanced packaging solutions for cutting-edge semiconductor devices. With a meticulous blend of precision engineering and innovative design, they cater to the demands of high-performance computing, telecommunications, and aerospace industries. Their expertise lies in the fabrication of Flip Chip Ball Grid Array (FCBGA)…

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FCBGA Substrates Manufacturer

2024-01-17 Company News / News / Notification / Trade News

FCBGA Substrates Manufacturer, Professional FCBGA substrate production company, professional team and equipment, high-precision substrate production is inseparable from high-quality materials, so we use ABF substrate. This guest article will explore the distinctive features of FCBGA Substrates and shed light on their remarkable contributions to the field of electronic engineering. Functioning…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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market@alcantapcb.com

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