Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

+086 0755 8524 1496 : market@alcantapcb.com |

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2024-04-02 Aluminum Nitride PCB Manufacturing
2024-04-02 Multilayer Ceramic PCB Manufacturing
2024-04-01 High Speed Mixed Dielectric PCB Manufacturing
2024-04-01 Multi-Cavity PCB | RF PCB Manufacturing
2024-03-29 Extra Small Pitch PCB Manufacturing
2024-03-29 Aluminum Nitride PCB (AlN PCB) Manufacturing
2024-03-28 Mixed Dielectric Rogers PCB Manufacturing
2024-03-28 Cavity PCB Technology Manufacturing
2024-03-27 Blind Vias&Buried Vias PCB Manufacturing
2024-03-27 Cavity PCB | High Frequency PCB Manufacturing
2024-03-26 Rogers Cavity PCB Manufacturing
2024-03-26 Ceramic PCB Substrates Manufacturing
2024-03-26 Cross Blind/Buried Vias PCB Manufacturing
2024-03-25 Mini Ceramics PCB Manufacturing
2024-03-25 3D Ceramic Packages Substrate Manufacturing
2024-03-25 Mixed Dielectric PCB Manufacturing
2024-03-24 Embedded IC PCB Manufacturing
2024-03-23 Microvia Substrates Manufacturing
2024-03-22 Embedded Cavity PCB Manufacturing
2024-03-21 Multi Cavity Substrates Manufacturing

Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

+086 0755 85241496

market@alcantapcb.com

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