Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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FCBGA (ABF) Substrate Manufacturer

2024-06-19 Company News / News / Notification / Trade News

What is FCBGA (ABF) Substrate? FCBGA (ABF) Substrate Manufacturer."FCBGA (ABF) Substrate Manufacturer" refers to a company specializing in the production of Flip Chip Ball Grid Array substrates using advanced build-up technologies. FCBGA (ABF) substrate, the full name is Flip Chip Ball Grid Array (Ajinomoto Build-up Film) substrate, is an advanced…

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Rogers RT Duroid 5880 Substrate Manufacturer

2024-06-18 Company News / News / Notification / Trade News

Rogers RT Duroid 5880 Substrate Manufacturer.Rogers RT Duroid 5880 Substrate Manufacturer specializes in producing high-frequency laminate materials ideal for microwave and RF applications. Known for its low dielectric constant and low loss tangent, the RT Duroid 5880 substrate offers exceptional performance in high-speed circuits. The manufacturer ensures precision, quality, and…

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RF SIP Substrate Manufacturer

2024-06-17 Company News / News / Notification / Trade News

RF SIP Substrate Manufacturer.Flip Chip (ABF) Substrate Manufacturer specializes in producing advanced packaging substrates that facilitate high-density interconnections for semiconductor devices. They focus on innovative design, precise manufacturing processes, and ensuring reliability in electronic assemblies. With the rapid development of wireless communication technology, RF SIP (Radio Frequency System Integrated Package)…

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5G Package Substrate Manufacturer

2024-06-16 Company News / News / Notification / Trade News

5G Package Substrate Manufacturer."5G Package Substrate Manufacturer" refers to a company specializing in the production of advanced substrates crucial for 5G technology, ensuring high-speed connectivity and reliability in electronic devices. Among the rapidly developing communication technologies, 5G technology is becoming the focus of global attention. The key to 5G communications…

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Ultra-thin CPU Substrates Manufacturer

2024-06-15 Company News / News / Notification / Trade News

What are Ultra-thin CPU Substrates? Ultra-thin CPU Substrates Manufacturer.We specialize in manufacturing ultra-thin CPU substrates, delivering cutting-edge solutions for high-performance computing needs. Our expertise lies in crafting substrates that enhance thermal management and signal integrity, meeting the demands of advanced electronic devices. Ultra-thin CPU substrates are a vital component in…

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GPU Package Substrates Manufacturer

2024-06-14 Company News / News / Notification / Trade News

GPU Package Substrates Manufacturer."GPU Package Substrates Manufacturer" refers to a company specializing in the production of substrates specifically designed for GPU (Graphics Processing Unit) packages. These substrates are engineered to meet high-performance demands, offering efficient thermal management and reliable electrical connectivity essential for modern graphics applications. In today's digital world,…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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