Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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RT5880 PCB Manufacturing

2024-04-08 Company News / News / Notification / Trade News

RT5880 PCB Manufacturing.RT5880 PCB Manufacturing involves the fabrication of printed circuit boards (PCBs) utilizing RT5880 laminate material. Renowned for its high-frequency performance and reliability, RT5880 is favored in applications requiring exceptional signal integrity, such as telecommunications and aerospace. Manufacturing processes encompass precise etching, drilling, and plating techniques to create intricate…

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BT Resin Substrate Manufacturing

2024-04-07 Company News / News / Notification / Trade News

BT Resin Substrate Manufacturing.BT resin substrate manufacturing involves the meticulous process of crafting substrates from materials infused with Benzoxazine resin. This cutting-edge technique amalgamates advanced chemistry with precision engineering, ensuring the creation of durable and high-performance substrates. Beginning with meticulous material selection, followed by precise molding and curing stages, it…

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Ceramic Substrate/Package Manufacturing

2024-04-06 Company News / News / Notification / Trade News

Ceramic Substrate/Package Manufacturing,Ceramic substrate/package manufacturing involves intricate processes in crafting durable, heat-resistant components pivotal in electronic devices. Initially, ceramic powders are meticulously blended, then shaped into precise forms using molding or printing techniques. Through meticulous firing, these green bodies solidify into robust ceramic structures. Advanced methods like laser cutting or…

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Minimum Trace&Clearance PCB Manufacturing

2024-04-05 Company News / News / Notification / Trade News

Minimum Trace&Clearance PCB Manufacturing.Minimum Trace & Clearance PCB Manufacturing refers to the process of producing printed circuit boards with extremely small trace widths and clearances between them. This advanced manufacturing technique enables the creation of densely packed electronic circuits, optimizing space usage and improving performance. Achieving such precision requires cutting-edge…

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Mini LED Substrate Manufacturing

2024-04-05 Company News / News / Notification / Trade News

Mini LED Substrate Manufacturing.Minimum Trace & Clearance PCB Manufacturing refers to the process of producing printed circuit boards with extremely small trace widths and clearances between them. This advanced manufacturing technique enables the creation of densely packed electronic circuits, optimizing space usage and improving performance. Achieving such precision requires cutting-edge…

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Organic Substrate FC-BGA Design Guideline

2024-04-04 Company News / News / Notification / Trade News

Organic Substrate FC-BGA Design Guideline.The Organic Substrate FC-BGA Design Guideline Manufacturing process is crucial in ensuring the reliability and performance of semiconductor packages. This process involves meticulous attention to material selection, substrate layering, and precise adherence to design guidelines to optimize thermal and electrical performance. It ensures robust interconnections, enhancing…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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market@alcantapcb.com

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