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Ultra-Multilayer FC-LGA Substrates Manufacturer

2024-06-25 회사 소식 / 소식 / 통지 / 무역 뉴스

Ultra-Multilayer FC-LGA Substrates Manufacturer.As a leading RF SIP (System-in-Package) substrate manufacturer, we specialize in producing high-performance substrates for advanced RF applications. Our expertise ensures superior signal integrity, miniaturization, and thermal management, meeting the demands of modern wireless communication, IoT, and 5G technologies. Our state-of-the-art manufacturing processes and rigorous quality control…

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Flip Chip (ABF) Substrate Manufacturer

2024-06-24 회사 소식 / 소식 / 통지 / 무역 뉴스

Flip Chip (ABF) Substrate Manufacturer.We specialize in the production of Flip Chip substrates using advanced ABF technology. Our expertise lies in crafting high-performance substrates that ensure robust interconnectivity and reliability for modern electronic devices. In the realm of modern electronics manufacturing, Flip Chip (ABF) Substrate plays an essential role. This…

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RF Package Substrates Manufacturer

2024-06-23 회사 소식 / 소식 / 통지 / 무역 뉴스

RF Package Substrates Manufacturer."RF Package Substrates Manufacturer" refers to a company specializing in the production of substrates tailored for RF (radio frequency) applications. They design and manufacture advanced materials and structures that optimize signal integrity, thermal management, and reliability in RF electronic devices. RF (Radio Frequency) package substrates are specialized…

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Ultra-Multilayer FC-BGA Package Substrates Manufacturer

2024-06-22 회사 소식 / 소식 / 통지 / 무역 뉴스

Ultra-Multilayer FC-BGA Package Substrates Manufacturer.Manufacturer specializing in Ultra-Multilayer FC-BGA Package Substrates excels in producing advanced interconnection solutions for high-density electronic applications. Ultra-Multilayer FC-BGA Package Substrates play a crucial role in modern electronic technology. These substrates are key to the miniaturization and high performance of electronic devices, widely used in various…

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AI Accelerator Module Substrate Manufacturer

2024-06-21 회사 소식 / 소식 / 통지 / 무역 뉴스

AI Accelerator Module Substrate Manufacturer.AI Accelerator Module Substrate Manufacturer specializes in designing and producing advanced substrates for AI accelerator modules, ensuring optimal performance and efficiency in neural network processing. What is AI Accelerator Module Substrate? AI Accelerator Module Substrate is a key electronic component carrying platform, usually made of insulating…

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Substrate For Chips Manufacturer

2024-06-20 회사 소식 / 소식 / 통지 / 무역 뉴스

Substrate For Chips Manufacturer."Substrate for Chips Manufacturer" refers to a specialized manufacturer that focuses on producing high-quality substrates used in chip packaging. They excel in designing and fabricating substrates tailored to meet the stringent requirements of modern semiconductor devices, ensuring optimal electrical performance and reliability. These manufacturers play a pivotal…

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우리의 주요 제품 유형, 초박형 PCB, 초소형 트레이스, 초소형 피치, 우리는 생산할 수 있습니다 2 layers를 100 고주파/고속 HDI 회로 기판 층, 우리는 또한 생산할 수 있습니다 2 layers를 20 고주파/고속 BGA 패키지 기판 층, 종래의 고주파/고속 회로 기판 납기는 대략 1 받는 사람 3 주. 고주파/고속 BGA 패키지 기판의 배달 시간, 예를 들어: 20 층 매우 작은 자취의 배달 시간 (20음/20um) ABF FC BGA 패키지 기판은 약 3 개월

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