FCCSP Flip Chip Package Substrate Manufacturer

FCCSP Flip Chip Package Substrate Manufacturer

2024-02-11 FCCSP Flip Chip Package Substrate Manufacturer

Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 宛先 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 月

+086 0755 85241496

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+8615014077679

market@alcantapcb.com

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