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High Frequency Package Substrate Supplier

2024-02-15 企業ニュース / ニュース / 通知 / 貿易ニュース

High Frequency package Substrate supplier, The package Substrate will be made with Rogers materials or other high frequency materials. we also make the package Substrate with high speed materials. High-frequency packaging substrates are fundamental and indispensable elements in contemporary high-frequency electronics. They form the foundation for hosting advanced electronic components…

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High Precision Packaging Substrate Supplier

2024-02-14 企業ニュース / ニュース / 通知 / 貿易ニュース

High precision packaging substrate Supplier, BT, Rogers, Showa Denko/ABF(Ajinomoto) high-speed and high frequency substrates manufacturing, specializes in small pitch BGA substrates. In the contemporary digital era, electronic devices surrounding us are undergoing a trend of miniaturization and enhanced potency. Concealed within these apparently straightforward gadgets lies an essential core element:…

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Organic Substrate FC BGA Substrate Manufacturer

2024-02-13 企業ニュース / ニュース / 通知 / 貿易ニュース

Organic Substrate FC BGA Substrate Manufacturer, Characteristic:Small units size,Super small Bump pitch, microtrace and microspacing, We use the ABF series materials to produce the FC BGA substrtes from 4 layer を 20 層. The passage describes the significance of Organic Substrate FC BGA (Flip Chip Ball Grid Array) Substrate in…

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Organic Package Firm

2024-02-12 企業ニュース / ニュース / 通知 / 貿易ニュース

Organic Package Firm, We mainly produce high layer packaging substrates, and we also deal with packaging services, we have professional packaging and assembly lines. In the ever-evolving PCB engineering, organic packaging substrates play a vital role. They are a fundamental material used in electronic components, providing a solid foundation for…

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FCCSP Flip Chip Package Substrate Manufacturer

2024-02-11 企業ニュース / ニュース / 通知 / 貿易ニュース

FCCSP Flip Chip Package Substrate Manufacturer, Advanced FCCSP Flip Chip Package Substrate will be made with BT Core, ABF core and other types core materials. we offer the FCCSP substrates from 2 layer を 20 層. fast lead time. and high quality. The FCCSP (Flip Chip Package Substrate) technology represents…

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Embedded Cavity Substrate Manufacturer

2024-02-10 企業ニュース / ニュース / 通知 / 貿易ニュース

Embedded Cavity Substrate Manufacturer, Embedded Slot PCB, BGA基板. and Buried Cavity Substrate manufacture. Open cavity(slot) on the PCB/Substrates or Open Buried Cavity(slot) In the middle of each layer of substrate.We specialize in producing various types of CAVITY PCBS. In the dynamic realm of PCB design, embedded cavity substrates have…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 宛先 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 月

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