パッケージング基板と超小型トレースHDIPCBの専門メーカー.

+086 0755 8524 1496 : market@alcantapcb.com |

TradeNews-Page37of246-Professionalhighspeedcircuitboardsupplier-Page37

貿易ニュース

家

貿易ニュース

High Frequency Package Substrate Supplier

2024-02-15 企業ニュース / ニュース / 通知 / 貿易ニュース

High Frequency package Substrate supplier, The package Substrate will be made with Rogers materials or other high frequency materials. we also make the package Substrate with high speed materials. High-frequency packaging substrates are fundamental and indispensable elements in contemporary high-frequency electronics. They form the foundation for hosting advanced electronic components…

続きを読む
High Precision Packaging Substrate Supplier

2024-02-14 企業ニュース / ニュース / 通知 / 貿易ニュース

High precision packaging substrate Supplier, BT, Rogers, Showa Denko/ABF(Ajinomoto) high-speed and high frequency substrates manufacturing, specializes in small pitch BGA substrates. In the contemporary digital era, electronic devices surrounding us are undergoing a trend of miniaturization and enhanced potency. Concealed within these apparently straightforward gadgets lies an essential core element:…

続きを読む
Organic Substrate FC BGA Substrate Manufacturer

2024-02-13 企業ニュース / ニュース / 通知 / 貿易ニュース

Organic Substrate FC BGA Substrate Manufacturer, Characteristic:Small units size,Super small Bump pitch, microtrace and microspacing, We use the ABF series materials to produce the FC BGA substrtes from 4 layer を 20 層. The passage describes the significance of Organic Substrate FC BGA (Flip Chip Ball Grid Array) Substrate in…

続きを読む
Organic Package Firm

2024-02-12 企業ニュース / ニュース / 通知 / 貿易ニュース

Organic Package Firm, We mainly produce high layer packaging substrates, and we also deal with packaging services, we have professional packaging and assembly lines. In the ever-evolving PCB engineering, organic packaging substrates play a vital role. They are a fundamental material used in electronic components, providing a solid foundation for…

続きを読む
FCCSP Flip Chip Package Substrate Manufacturer

2024-02-11 企業ニュース / ニュース / 通知 / 貿易ニュース

FCCSP Flip Chip Package Substrate Manufacturer, Advanced FCCSP Flip Chip Package Substrate will be made with BT Core, ABF core and other types core materials. we offer the FCCSP substrates from 2 layer を 20 層. fast lead time. and high quality. The FCCSP (Flip Chip Package Substrate) technology represents…

続きを読む
Embedded Cavity Substrate Manufacturer

2024-02-10 企業ニュース / ニュース / 通知 / 貿易ニュース

Embedded Cavity Substrate Manufacturer, Embedded Slot PCB, BGA基板. and Buried Cavity Substrate manufacture. Open cavity(slot) on the PCB/Substrates or Open Buried Cavity(slot) In the middle of each layer of substrate.We specialize in producing various types of CAVITY PCBS. In the dynamic realm of PCB design, embedded cavity substrates have…

続きを読む

主な製品タイプ, 超薄型PCB, 超微量トレース, 超小型ピッチ, 私たちは生産することができます 2 layers を 100 高周波/高速HDI回路基板の層, また、生産することもできます 2 layers を 20 高周波/高速BGAパッケージ基板の層, 従来の高周波/高速回路基板の納期は約 1 宛先 3 週間. 高周波/高速BGAパッケージ基板の納期, 例えば: 20層超小型トレースの納期 (20うーん/20μm) ABF FC BGAパッケージ基板は約 3 月

+086 0755 85241496

ヘンリチナッシュ

market@alcantapcb.com

トップに戻る

見積もりを取得 ?