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Global Semiconductor Substrate Manufacturer

2024-02-21 企業ニュース / ニュース / 通知 / 貿易ニュース

Global Semiconductor Substrate Manufacturer, High frequency packaging substrate, high speed packaging substrate, ceramic packaging substrate, Glass packaging substrate manufacturing. Semiconductor substrates play a vital role in the contemporary electronics sector, serving as the fundamental framework for electronic devices. They facilitate the integration and support of chips, circuits, and other essential…

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Module Substates Manufacturer

2024-02-20 企業ニュース / ニュース / 通知 / 貿易ニュース

Module Substates Manufacturer, Small size module substrates with Ultra-small gap. The finished substrate surface has high smoothness. We are a professional substrate supplier. Module substrates, also referred to as packaging substrates, are vital components in electronic devices, providing the foundational structure for supporting and connecting diverse electronic elements. They fulfill…

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FC-CSP Substrates Manufacturer

2024-02-19 企業ニュース / ニュース / 通知 / 貿易ニュース

FC-CSP Substrates Manufacturer, Professional FCCSP substrate production team, professional production equipment and technology, the factory has more than 10,000 employees. The fundamental concept involves flipping the chip and directly connecting it to the substrate, resulting in a compact and highly integrated packaging structure. Leveraging chip-scale packaging, FC-CSP substrates can accommodate…

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CPCORE Structure Substrates Manufacturer

2024-02-18 企業ニュース / ニュース / 通知 / 貿易ニュース

CPCORE Structure Substrates Manufacturer, Professional packaging substrate production company, mainly produces high layer substrate, we have more than 10,000 employees of the production plant. This passage highlights the significance of CPCORE structure manufacturers in the realm of modern electronics. These manufacturers specialize in producing CPCORE structures, essential components in integrated…

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SHDBU Substrates Manufacturer

2024-02-17 企業ニュース / ニュース / 通知 / 貿易ニュース

SHDBU Substrates Manufacturer. Extra small trace and spacing package substrates and HDI PCBs production. we offer high quality substrates from 2 layer を 20 layers. SHDBU Substrates are indispensable key components in electronic engineering, playing an important role in supporting and connecting various electronic components. In short, they are special…

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High Speed Package Substrate Manufacturer

2024-02-16 企業ニュース / ニュース / 通知 / 貿易ニュース

High Speed package Substrate Manufacturer. Mitsubishi substrates materials. Showa Denko/Ajinomoto ABF materials. Professional high layer packaging substrate production supplier. High-speed packaging substrates are vital components within the electronics industry, serving as connectors to link chips with motherboards for high-speed signal transmission. These substrates boast advanced materials and processes tailored specifically…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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