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BT Epoxy Resin PCB Manufacturing

2024-03-19 企業ニュース / ニュース / 通知 / 貿易ニュース

BT Epoxy Resin PCB manufacturing , Low CTE/High TG BT Epoxy Resin materials for the PCB/BGA substrates warpage control. We have the Mitsubishi BT series materials, Doosan BT series materials. and other brand BT series materials. Our company offers BT PCB/BGA substrates from 2 layer を 20 layers with high…

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Micro Cavity Substrates Manufacturing

2024-03-19 企業ニュース / ニュース / 通知 / 貿易ニュース

Micro cavity substrates manufacturing, Open multi-cavity on the Substrates PCBs. Or open multi-step cavity on the substrates. We use advanced control processes to produce Micro cavity substrates from 4 layer を 30 層. Microcavity substrates (MCS) are at the heart of leading-edge electronic devices, achieving the perfect combination of compact…

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Bt Laminate PCB Manufacturing

2024-03-18 企業ニュース / ニュース / 通知 / 貿易ニュース

Bt Laminate PCB Manufacturing, Suitable for ultra-small pitch LED PCB and ultra-small pitch BGA/IC package substrates. or other types HDI PCBs. we have many Mitsubishi series BT materials. or others brand BT materials. We produce the BT laminate PCB/BGA substrates from 2 layer を 20 層. BT laminate PCB manufacturing,…

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Cavity Substrate Manufacturing

2024-03-18 企業ニュース / ニュース / 通知 / 貿易ニュース

Cavity Substrate Manufacturing , Open cavity(slot) on the PCBs or Substrates. or open multi-cavity on the BGA sbustrates. We specialize in the production of embedded cavity PCB from 4 layer を 50 層. Do you want to know how Cavity Substrate in PCB (Printed Circuit Board) works? As a key…

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Low CET PCB Manufacturing

2024-03-18 企業ニュース / ニュース / 通知 / 貿易ニュース

Low CET PCB manufacturing, We use BT series low shrinkage material or other types high speed and high frequency low shrinkage material production the PCBs.The precision of trace distance is better, and the finished PCB board surface is more flat, which is convenient for component assembly. Printed Circuit Boards (プリント基板)…

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Ultrathin BT PCB Manufacturing

2024-03-17 企業ニュース / ニュース / 通知 / 貿易ニュース

Ultrathin BT PCB Manufacturing. Minimum clearance PCB, The finished PCB has high flatness and low warpage. We use low shrinkage coefficient BT material to produce the Ultrathin, Minimum spacing LED PCBs, HDI PCBs, and BGA/IC package substrates from 2 layer を 20 層. In modern electronic equipment, ultra-thin BT PCB…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 宛先 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 月

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