パッケージング基板と超小型トレースHDIPCBの専門メーカー.

+086 0755 8524 1496 : market@alcantapcb.com |

Notification-Page11of246-Professionalhighspeedcircuitboardsupplier-Page11

通知

家

通知

2024-03-06 Ceramic Package Substrate Manufacturer
2024-03-05 Semiconductor IC Substrate Manufacturer
2024-03-04 BGA/IC Substrate Package Supplier
2024-03-01 Substrate & Packaging Manufacturer
2024-02-29 Organic Packaging Chip Substrates
2024-02-28 Top 10 Packaging Substrate Firm
2024-02-27 Top 10 Package Substrate Manufacturer
2024-02-26 Global Packaging Substrate Manufacturer
2024-02-23 Global Package Substrate Manufacturer
2024-02-22 Global Semiconductor Packaging Manufacturer
2024-02-21 Global Semiconductor Substrate Manufacturer
2024-02-20 Module Substates Manufacturer
2024-02-19 FC-CSP Substrates Manufacturer
2024-02-18 CPCORE Structure Substrates Manufacturer
2024-02-17 SHDBU Substrates Manufacturer
2024-02-16 High Speed Package Substrate Manufacturer
2024-02-15 High Frequency Package Substrate Supplier
2024-02-14 High Precision Packaging Substrate Supplier
2024-02-13 Organic Substrate FC BGA Substrate Manufacturer
2024-02-12 Organic Package Firm

Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

+086 0755 85241496

ヘンリチナッシュ

market@alcantapcb.com

トップに戻る

見積もりを取得 ?