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Multi-Chip FC-BGA Package Substrates Manufacturer

2024-06-13 企業ニュース / ニュース / 通知 / 貿易ニュース

Multi-Chip FC-BGA Package Substrates Manufacturer."Multi-Chip FC-BGA Package Substrates Manufacturer specializes in designing and producing advanced substrates for multi-chip flip chip ball grid array (FC-BGA) packages. We focus on delivering high-performance solutions that meet the demands of modern electronics, ensuring reliability and efficiency in diverse applications." In today's digital world, the…

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ABF GL102R8HF Package Substrates Manufacturer

2024-06-12 企業ニュース / ニュース / 通知 / 貿易ニュース

ABF GL102R8HF Package Substrates Manufacturer.ABF GL102R8HF Package Substrates Manufacturer is a leading provider of advanced packaging substrates for electronic devices. Their expertise lies in crafting high-quality substrates that ensure superior performance, reliability, and miniaturization in various applications. With cutting-edge technology and a commitment to innovation, they cater to the evolving…

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RF PCB Manufacturer

2024-06-11 企業ニュース / ニュース / 通知 / 貿易ニュース

RF PCB Manufacturer.As an RF PCB manufacturer, we specialize in crafting high-quality printed circuit boards optimized for radio frequency applications. Our expertise lies in creating PCBs tailored to meet the demanding requirements of wireless communication systems, radar systems, satellite communication, and more. With precision engineering and cutting-edge technology, we ensure…

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The Thinnest PCB Manufacturer

2024-06-10 企業ニュース / ニュース / 通知 / 貿易ニュース

The Thinnest PCB Manufacturer.Discover the epitome of precision and innovation with "The Thinnest PCB Manufacturer." Setting the benchmark for excellence, we specialize in crafting ultra-thin printed circuit boards (プリント基板) with unrivaled precision and quality. Experience the pinnacle of technological advancement with our cutting-edge solutions tailored to meet the most demanding…

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Ultra-thin 5G Substrate Manufacturer

2024-06-09 企業ニュース / ニュース / 通知 / 貿易ニュース

What is Ultra-thin 5G Substrate? Ultra-thin 5G Substrate Manufacturer.As an ultra-thin 5G substrate manufacturer, we specialize in crafting cutting-edge substrates tailored for the demands of next-generation wireless technology. Our advanced manufacturing processes ensure precision and reliability, enabling seamless integration into high-speed communication systems. With a commitment to innovation and quality,…

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Semiconductor Glass Substrate Manufacturer

2024-06-08 企業ニュース / ニュース / 通知 / 貿易ニュース

Semiconductor Glass Substrate Manufacturer.As a semiconductor glass substrate manufacturer, we specialize in crafting precision-engineered substrates tailored to the exacting demands of modern electronics. Our expertise lies in the production of high-quality glass substrates that serve as the foundation for semiconductor devices, ensuring optimal performance, reliability, and efficiency in various applications.…

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主な製品タイプ, 超薄型PCB, 超微量トレース, 超小型ピッチ, 私たちは生産することができます 2 layers を 100 高周波/高速HDI回路基板の層, また、生産することもできます 2 layers を 20 高周波/高速BGAパッケージ基板の層, 従来の高周波/高速回路基板の納期は約 1 宛先 3 週間. 高周波/高速BGAパッケージ基板の納期, 例えば: 20層超小型トレースの納期 (20うーん/20μm) ABF FC BGAパッケージ基板は約 3 月

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