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Embedded Slot PCB Manufacturing

2024-03-21 企業ニュース / ニュース / 通知 / 貿易ニュース

Embedded Slot PCB Manufacturing.Embedded Slot PCB Manufacturing involves the integration of slots directly into printed circuit boards (プリント基板), enabling the seamless incorporation of components within the board structure. This advanced manufacturing process ensures precise alignment and secure placement of embedded elements, enhancing the functionality and durability of electronic devices. By…

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Multi Cavity PCB Manufacturing

2024-03-20 企業ニュース / ニュース / 通知 / 貿易ニュース

Multi Cavity PCB Manufacturing.Multi cavity PCB manufacturing refers to the process of creating printed circuit boards with multiple cavities or cutouts within a single board. This advanced technique enables the integration of diverse components and functionalities into a compact space, optimizing electronic device design. By accommodating various modules and components…

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Micro Via PCB Manufacturing

2024-03-20 企業ニュース / ニュース / 通知 / 貿易ニュース

Micro Via PCB Manufacturing.Micro Via PCB Manufacturing refers to the process of creating printed circuit boards (プリント基板) with extremely small vias, which are the pathways that connect different layers of the PCB. This advanced technique enables the construction of intricate electronic circuits in compact devices such as smartphones, tablets, and…

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Embedded Components PCB Manufacturing

2024-03-20 企業ニュース / ニュース / 通知 / 貿易ニュース

Embedded Components PCB Manufacturing.Embedded Components PCB Manufacturing refers to the process of integrating electronic components directly onto the printed circuit board (プリント基板) during fabrication. This advanced technique eliminates the need for separate assembly, reducing production costs and enhancing reliability. Through precision engineering, components such as resistors, capacitors, and integrated circuits…

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Micro Cavity PCB Supplier

2024-03-19 企業ニュース / ニュース / 通知 / 貿易ニュース

Micro cavity PCB Supplier, Specializing in the production of various types of Cavity PCBs, Embedded Slot PCBs, and Open multi- Cavity on the PCBs/BGA/IC substrates. We offer Cavity PCBs from 4 layer を 30 層. Micro Cavity PCB manufacturing is a critical technology that provides precision circuit boards for electronic…

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BT Epoxy Resin PCB Manufacturing

2024-03-19 企業ニュース / ニュース / 通知 / 貿易ニュース

BT Epoxy Resin PCB manufacturing , Low CTE/High TG BT Epoxy Resin materials for the PCB/BGA substrates warpage control. We have the Mitsubishi BT series materials, Doosan BT series materials. and other brand BT series materials. Our company offers BT PCB/BGA substrates from 2 layer を 20 layers with high…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 宛先 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 月

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