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Rogers 4003C PCB Manufacturing

2024-04-11 企業ニュース / ニュース / 通知 / 貿易ニュース

Rogers 4003C PCB Manufacturing.Rogers 4003C PCB Manufacturer is a pioneering entity in the realm of circuit board fabrication. Renowned for its precision and reliability, this manufacturer employs cutting-edge techniques to craft PCBs of unparalleled quality. With a meticulous attention to detail, they ensure each board meets exact specifications, catering to…

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Minimum Pad Clearance PCB Manufacturing

2024-04-10 企業ニュース / ニュース / 通知 / 貿易ニュース

Minimum Pad Clearance PCB Manufacturing.Minimum pad clearance in PCB manufacturing refers to the smallest allowable distance between copper pads on a printed circuit board (PCB). This critical specification ensures that adjacent pads don't short-circuit or interfere with each other during assembly or operation. Achieving an optimal minimum pad clearance demands…

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Ceramic Packages For MEMS Sensors Manufacturing

2024-04-10 企業ニュース / ニュース / 通知 / 貿易ニュース

Ceramic Packages For MEMS Sensors Manufacturing.Ceramic packages play a pivotal role in the manufacturing process of MEMS sensors, encapsulating delicate micro-electromechanical systems with precision and durability. These meticulously crafted casings provide a shield against external influences, ensuring the sensors' functionality remains intact in diverse environments. Employing advanced techniques, manufacturers intricately…

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Micro LED PCB Manufacturing

2024-04-09 企業ニュース / ニュース / 通知 / 貿易ニュース

Micro LED PCB Manufacturing.Micro LED PCB manufacturing involves the intricate process of fabricating printed circuit boards tailored to accommodate micro LED technology. This advanced manufacturing procedure integrates precision engineering and cutting-edge techniques to create PCBs with densely packed micro LED arrays. It encompasses various stages such as substrate preparation, deposition…

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Cavity Substrate| Package Substrate Manufacturing

2024-04-09 企業ニュース / ニュース / 通知 / 貿易ニュース

Cavity Substrate| Package Substrate Manufacturing.Cavity substrate and package substrate manufacturing involve intricate processes pivotal to electronic component production. Cavity substrate fabrication typically includes etching, deposition, and bonding, forming precise recesses for integrated circuits. Meanwhile, package substrate manufacturing entails intricate layering, often using materials like fiberglass or laminate, meticulously crafted to…

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Advanced Semiconductor Glass Substrates Manufacturing

2024-04-08 企業ニュース / ニュース / 通知 / 貿易ニュース

Advanced Semiconductor Glass Substrates Manufacturing.The manufacturing of advanced semiconductor glass substrates involves cutting-edge techniques and precision engineering. These substrates serve as the foundation for semiconductor devices, enabling high-performance electronics. Through intricate processes such as chemical vapor deposition and thermal treatment, ultra-thin layers of glass are precisely deposited and patterned to…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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