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Ultrathin IC Substrate Manufacturer

2024-05-15 企業ニュース / ニュース / 通知 / 貿易ニュース

Ultrathin IC Substrate Manufacturer.The Ultrathin IC Substrate Manufacturer is at the forefront of technological innovation, specializing in crafting substrates of unparalleled thinness and precision. With cutting-edge fabrication techniques, they engineer substrates to accommodate the demands of modern electronics, ensuring optimal performance and efficiency. Their expertise lies in the meticulous crafting…

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AI Processor Package Substrates Manufacturer

2024-05-14 企業ニュース / ニュース / 通知 / 貿易ニュース

AI Processor Package Substrates Manufacturer.The AI Processor Package Substrates Manufacturer specializes in crafting advanced substrates tailored for AI processor packages. Their precision engineering ensures optimal performance and reliability, meeting the demanding requirements of cutting-edge AI technologies. With a commitment to innovation, they integrate the latest materials and techniques, enabling seamless…

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Ajinomoto GX92 Package Substrate Manufacturer

2024-05-14 企業ニュース / ニュース / 通知 / 貿易ニュース

Ajinomoto GX92 Package Substrate Manufacturer.Ajinomoto GX92 Package Substrate Manufacturer specializes in crafting cutting-edge substrates for packaging solutions. With a dedication to quality and innovation, they engineer substrates that cater to diverse industrial needs, ensuring optimal performance and reliability. Their expertise lies in developing materials that enhance product protection, shelf life,…

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RF/microwave PCB Manufacturer

2024-05-13 企業ニュース / ニュース / 通知 / 貿易ニュース

RF/microwave PCB Manufacturer.A premier RF/microwave PCB manufacturer, dedicated to crafting precision circuitry for cutting-edge telecommunications, aerospace, and medical devices. With state-of-the-art facilities and a seasoned team of engineers, we specialize in the fabrication of high-frequency printed circuit boards tailored to meet the demanding requirements of modern wireless communication systems. Our…

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Ultra-thin BGA Substrate Manufacturer

2024-05-13 企業ニュース / ニュース / 通知 / 貿易ニュース

Ultra-thin BGA Substrate Manufacturer.An innovative leader in electronic manufacturing, our company specializes in crafting ultra-thin Ball Grid Array (BGA) substrates. With cutting-edge technology and precision engineering, we produce substrates that push the boundaries of miniaturization in electronic devices. Our commitment to excellence ensures that each substrate meets the highest standards…

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Ultrathin Antennae PCB Manufacturer

2024-05-12 企業ニュース / ニュース / 通知 / 貿易ニュース

Ultrathin Antennae PCB Manufacturer.Our company is a leading Ultrathin Antennae PCB Manufacturer, specializing in the production of ultra-slim, high-performance printed circuit boards for advanced wireless communication systems. With cutting-edge technology and precision engineering, we deliver top-quality, reliable, and efficient antenna solutions that cater to the demanding needs of modern electronic…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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