Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

TradeNews-Page32of246-Professionalhighspeedcircuitboardsupplier-Page32

Fachnachrichten

Heim

Fachnachrichten

BT Epoxy Resin PCB Manufacturing

2024-03-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BT Epoxy Resin PCB manufacturing , Low CTE/High TG BT Epoxy Resin materials for the PCB/BGA substrates warpage control. We have the Mitsubishi BT series materials, Doosan BT series materials. and other brand BT series materials. Our company offers BT PCB/BGA substrates from 2 Schicht zu 20 layers with high…

Weiterlesen
Micro Cavity Substrates Manufacturing

2024-03-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Micro cavity substrates manufacturing, Open multi-cavity on the Substrates PCBs. Or open multi-step cavity on the substrates. We use advanced control processes to produce Micro cavity substrates from 4 Schicht zu 30 Schichten. Microcavity substrates (MCS) are at the heart of leading-edge electronic devices, achieving the perfect combination of compact…

Weiterlesen
Bt Laminate PCB Manufacturing

2024-03-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Bt Laminate PCB Manufacturing, Suitable for ultra-small pitch LED PCB and ultra-small pitch BGA/IC package substrates. or other types HDI PCBs. we have many Mitsubishi series BT materials. or others brand BT materials. We produce the BT laminate PCB/BGA substrates from 2 Schicht zu 20 Schichten. BT laminate PCB manufacturing,…

Weiterlesen
Cavity Substrate Manufacturing

2024-03-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Cavity Substrate Manufacturing , Open cavity(slot) on the PCBs or Substrates. or open multi-cavity on the BGA sbustrates. We specialize in the production of embedded cavity PCB from 4 Schicht zu 50 Schichten. Do you want to know how Cavity Substrate in PCB (Printed Circuit Board) works? As a key…

Weiterlesen
Low CET PCB Manufacturing

2024-03-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Low CET PCB manufacturing, We use BT series low shrinkage material or other types high speed and high frequency low shrinkage material production the PCBs.The precision of trace distance is better, and the finished PCB board surface is more flat, which is convenient for component assembly. Printed Circuit Boards (Leiterplatten)…

Weiterlesen
Ultrathin BT PCB Manufacturing

2024-03-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin BT PCB Manufacturing. Minimum clearance PCB, The finished PCB has high flatness and low warpage. We use low shrinkage coefficient BT material to produce the Ultrathin, Minimum spacing LED PCBs, HDI PCBs, and BGA/IC package substrates from 2 Schicht zu 20 Schichten. In modern electronic equipment, ultra-thin BT PCB…

Weiterlesen

Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

Zurück zum Anfang

Angebot anfordern ?