Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

Notification-Page3of246-Professionalhighspeedcircuitboardsupplier-Page3

Benachrichtigung

Heim

Benachrichtigung

2024-06-21 AI Accelerator Module Substrate Manufacturer
2024-06-20 Substrate For Chips Manufacturer
2024-06-19 FCBGA (ABF) Substrate Manufacturer
2024-06-18 Rogers RT Duroid 5880 Substrate Manufacturer
2024-06-17 RF SIP Substrate Manufacturer
2024-06-16 5G Package Substrate Manufacturer
2024-06-15 Ultra-thin CPU Substrates Manufacturer
2024-06-14 GPU Package Substrates Manufacturer
2024-06-13 Multi-Chip FC-BGA Package Substrates Manufacturer
2024-06-12 ABF GL102R8HF Package Substrates Manufacturer
2024-06-11 RF PCB Manufacturer
2024-06-10 The Thinnest PCB Manufacturer
2024-06-09 Ultra-thin 5G Substrate Manufacturer
2024-06-08 Semiconductor Glass Substrate Manufacturer
2024-06-07 Flip Chip BGA Substrate Manufacturer
2024-06-06 Ultra-Multilayer BGA Substrates Manufacturer
2024-06-05 RT Duroid 5880 Substrate Manufacturer
2024-06-04 Microtrace Antenna Circuit Board Manufacturer
2024-06-03 IPC Class III Boards Manufacturer
2024-06-02 Ultra-Multilayer FC-BGA Substrates Manufacturer

Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

Zurück zum Anfang

Angebot anfordern ?