Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Multi-Chip FC-BGA Package Substrates Manufacturer

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RF PCB Manufacturer

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The Thinnest PCB Manufacturer

2024-06-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

The Thinnest PCB Manufacturer.Discover the epitome of precision and innovation with "The Thinnest PCB Manufacturer." Setting the benchmark for excellence, we specialize in crafting ultra-thin printed circuit boards (Leiterplatten) with unrivaled precision and quality. Experience the pinnacle of technological advancement with our cutting-edge solutions tailored to meet the most demanding…

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Ultra-thin 5G Substrate Manufacturer

2024-06-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

What is Ultra-thin 5G Substrate? Ultra-thin 5G Substrate Manufacturer.As an ultra-thin 5G substrate manufacturer, we specialize in crafting cutting-edge substrates tailored for the demands of next-generation wireless technology. Our advanced manufacturing processes ensure precision and reliability, enabling seamless integration into high-speed communication systems. With a commitment to innovation and quality,…

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Semiconductor Glass Substrate Manufacturer

2024-06-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor Glass Substrate Manufacturer.As a semiconductor glass substrate manufacturer, we specialize in crafting precision-engineered substrates tailored to the exacting demands of modern electronics. Our expertise lies in the production of high-quality glass substrates that serve as the foundation for semiconductor devices, ensuring optimal performance, reliability, and efficiency in various applications.…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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