Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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FCBGA Package Substrate Firm

2024-01-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCBGA Package Substrate Firm, High multilayer and microtrace and smallest spacing FCBGA Package substrates production. we use the advanced Sap and Msap technology to produce the FCBGA, FCCSP, SIP package Substrate with ABF Base or Mitsubishi BT base. The FCBGA Package Substrate, featuring a Flip-Chip Ball Grid Array structure, has…

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Packaging Substrate Manufacturer

2024-01-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Packaging Substrate Manufacturer. Professional high-speed Packaging Substrates supplier. We have a wide range of core materials and will produce a variety of packaging substrates according to the materials you require. Packaging Substrates, intricately designed, serve as specialized platforms that support and interconnect circuits, accommodating the mounting and connection of chips,…

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Package Substrate Manufacturer

2024-01-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Package Substrate Manufacturer.The Package Substrate Manufacturer is a pivotal player in the semiconductor industry, specializing in crafting substrates crucial for electronic packaging. With precision engineering and cutting-edge technology, they fabricate substrates tailored to specific chip requirements, ensuring optimal performance and reliability. Their expertise lies in designing substrates that facilitate efficient…

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Flip Chip Package Substrate Manufacturer

2024-01-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip Package Substrate Manufacturer. FCCSP,FCBGA, SIP Package Substrate manufacture from 2 Schicht zu 20 Schichten. we use the low CET base materials to build the minimum trace and spacing package substrates from 2 Schicht zu 20 Schichten. abuot the base(core) materials. we can use the Mitsubishi BT base materials,…

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Flip Chip Packaging Substrate Supplier

2024-01-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip Packaging Substrate Supplier. We use the Mitsubishi BT materials, ABF core materials, and other types High speed and high frequency material to produce the Flip chip package substrates from 2 Schicht zu 20 layers .to use the advanced Msap, and Sap technology. Flip Chip Packaging Substrate is a…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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