Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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BGA Cavity Substrate Manufacturer

2024-02-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BGA Cavity Substrate Manufacturer, High speed and high frequency Cavity packaging substrate production. Open cavity(slot) on the PCB or BGA substrates. To do the Depth control slot on the base materials. BGA Cavity Substrate is an innovative Package Substrate. Its unique feature is that a groove (Cavity) is formed in…

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CSP package substrate Manufacturer

2024-02-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CSP package substrate Manufacturer, High speed and high frequency CSP packaging substrate supplier, advanced Sap/Msap tech, fast delivery, stable quality. we offer CSP substrates from 2 Schicht zu 20 Schichten. CSP Package Substrates are a key electronic component that are widely used in modern PCB (Printed Circuit Board, printed circuit…

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FCCSP Package Substrate Manufacturer

2024-02-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCCSP Package Substrate Manufacturer, BT base materials, ABF base materials, HF base materials FCCSP Package Substrate manufacturing from 4 Schicht zu 20 Schichten. microtrace and microspacing. The BT FCCSP Package Substrate, an innovative circuit board in electronic engineering, combines advanced features like Ball Grid Array (BGA) and Chip Scale Package…

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Wire Bond Substrate Manufacturer

2024-02-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Wire Bond Substrate Manufacturer, BGA package substrates will be made with Wire Bonding. The best surface treatment process is ENEPIG. the Wire Bonding result will be more better than other surface treatment process. We will produce the surface treatment process according to your requirements. Wire Bond Substrate is a vital…

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Flip Chip CSP Package Substrate Manufacturer

2024-02-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip CSP Package Substrate Manufacturer, Professional FCCSP /FCBGA/SIP Package Substrate production factory. I mainly produce high precision multilayer substrates from 4 Schicht zu 20 Schichten. This reduces the length of wires compared to traditional packages, thereby enhancing the speed and stability of electrical signal transmission. Furthermore, this design allows…

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Chip Scale Package (CSP) Substrate Manufacturer

2024-02-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Chip Scale Package (CSP) Substrate Manufacturer. FCCSP, FCBGA, SIP Package substrates manufacture from 4 Schicht zu 20 Schichten. There are more than 20,000 employees. Chip Scale Package (CSP) substrate is an innovative packaging solution that holds significant importance in contemporary electronic devices. Its distinctive feature lies in its compact design,…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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