Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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High Precision Packaging Substrate Supplier

2024-02-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High precision packaging substrate Supplier, BT, Rogers, Showa Denko/ABF(Ajinomoto) high-speed and high frequency substrates manufacturing, specializes in small pitch BGA substrates. In the contemporary digital era, electronic devices surrounding us are undergoing a trend of miniaturization and enhanced potency. Concealed within these apparently straightforward gadgets lies an essential core element:…

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Organic Substrate FC BGA Substrate Manufacturer

2024-02-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Substrate FC BGA Substrate Manufacturer, Characteristic:Small units size,Super small Bump pitch, microtrace and microspacing, We use the ABF series materials to produce the FC BGA substrtes from 4 Schicht zu 20 Schichten. The passage describes the significance of Organic Substrate FC BGA (Flip Chip Ball Grid Array) Substrate in…

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Organic Package Firm

2024-02-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Package Firm, We mainly produce high layer packaging substrates, and we also deal with packaging services, we have professional packaging and assembly lines. In the ever-evolving PCB engineering, organic packaging substrates play a vital role. They are a fundamental material used in electronic components, providing a solid foundation for…

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FCCSP Flip Chip Package Substrate Manufacturer

2024-02-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCCSP Flip Chip Package Substrate Manufacturer, Advanced FCCSP Flip Chip Package Substrate will be made with BT Core, ABF core and other types core materials. we offer the FCCSP substrates from 2 Schicht zu 20 Schichten. fast lead time. and high quality. The FCCSP (Flip Chip Package Substrate) technology represents…

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Embedded Cavity Substrate Manufacturer

2024-02-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded Cavity Substrate Manufacturer, Embedded Slot PCB, BGA-Substrate. and Buried Cavity Substrate manufacture. Open cavity(slot) on the PCB/Substrates or Open Buried Cavity(slot) In the middle of each layer of substrate.We specialize in producing various types of CAVITY PCBS. In the dynamic realm of PCB design, embedded cavity substrates have…

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Organic Packaging Firm

2024-02-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Packaging firm. We mainly produce various types of packaging substrates, at the same time, we also do packaging business, A factory with more than 10,000 employees. Organic packaging plays a crucial role in modern PCB engineering, holding a pivotal position as the primary interface for electronic components. It establishes…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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