Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Module Substates Manufacturer

2024-02-20 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Module Substates Manufacturer, Small size module substrates with Ultra-small gap. The finished substrate surface has high smoothness. We are a professional substrate supplier. Module substrates, also referred to as packaging substrates, are vital components in electronic devices, providing the foundational structure for supporting and connecting diverse electronic elements. They fulfill…

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FC-CSP Substrates Manufacturer

2024-02-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FC-CSP Substrates Manufacturer, Professional FCCSP substrate production team, professional production equipment and technology, the factory has more than 10,000 employees. The fundamental concept involves flipping the chip and directly connecting it to the substrate, resulting in a compact and highly integrated packaging structure. Leveraging chip-scale packaging, FC-CSP substrates can accommodate…

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CPCORE Structure Substrates Manufacturer

2024-02-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CPCORE Structure Substrates Manufacturer, Professional packaging substrate production company, mainly produces high layer substrate, Wir haben mehr als 10,000 employees of the production plant. This passage highlights the significance of CPCORE structure manufacturers in the realm of modern electronics. These manufacturers specialize in producing CPCORE structures, essential components in integrated…

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SHDBU Substrates Manufacturer

2024-02-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

SHDBU Substrates Manufacturer. Extra small trace and spacing package substrates and HDI PCBs production. we offer high quality substrates from 2 Schicht zu 20 Schichten. SHDBU Substrates are indispensable key components in electronic engineering, playing an important role in supporting and connecting various electronic components. In short, they are special…

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High Speed Package Substrate Manufacturer

2024-02-16 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High Speed package Substrate Manufacturer. Mitsubishi substrates materials. Showa Denko/Ajinomoto ABF materials. Professional high layer packaging substrate production supplier. High-speed packaging substrates are vital components within the electronics industry, serving as connectors to link chips with motherboards for high-speed signal transmission. These substrates boast advanced materials and processes tailored specifically…

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High Frequency Package Substrate Supplier

2024-02-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High Frequency package Substrate supplier, The package Substrate will be made with Rogers materials or other high frequency materials. we also make the package Substrate with high speed materials. High-frequency packaging substrates are fundamental and indispensable elements in contemporary high-frequency electronics. They form the foundation for hosting advanced electronic components…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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