Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Top 10 Packaging Substrate Firm

2024-02-28 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Top 10 Packaging Substrate Firm, Substrate production company has more than 10,000 employees, a professional engineer team of more than 100 people, advanced production equipment and process. Package substrate is a critical element within the electronics industry, serving as a pivotal component in connecting and supporting electronic elements. It offers…

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Top 10 Package Substrate Manufacturer

2024-02-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Top 10 package Substrate Manufacturer, HDI multilayer package Substrate company,Our factory has more than 10,000 employees, there is enough production space, delivery on time, stable quality. In today's electronic manufacturing industry, the Package Substrate serves as a fundamental component essential for supporting and interconnecting electronic elements such as chips, packages,…

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Global Packaging Substrate Manufacturer

2024-02-26 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Packaging Substrate Supplier, BT core, Rogers Core, High TG FR4 core, ABF core, and other types materials substrates manufacture. we offer small gap/ trace BGA substrates from 2 Schicht zu 20 layrs. In today's electronics industry, the packaging substrate holds immense importance as a crucial electronic component. Its primary…

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Global Package Substrate Manufacturer

2024-02-23 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Package Substrate Manufacturer. We have a variety of packaging substrate materials, high TG, high speed, low shrinkage coefficient. we produce the HDI Package substrates from 2 Schicht zu 20 Schichten. In the dynamic realm of electronic technology today, Package Substrate has risen as a fundamental element in circuit board…

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Global Semiconductor Packaging Manufacturer

2024-02-22 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Semiconductor Packaging Manufacturer, We mainly produce packaging substrates, we also assemble semiconductor packaging business, we have our own assembly line. The PCB package substrate plays a crucial role in the modern electronics industry, serving as a fundamental foundation for semiconductor packaging and performing various essential functions. Its key roles…

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Global Semiconductor Substrate Manufacturer

2024-02-21 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Global Semiconductor Substrate Manufacturer, High frequency packaging substrate, high speed packaging substrate, ceramic packaging substrate, Glass packaging substrate manufacturing. Semiconductor substrates play a vital role in the contemporary electronics sector, serving as the fundamental framework for electronic devices. They facilitate the integration and support of chips, circuits, and other essential…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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