Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Semiconductor FC BGA Substrate Manufacturer

2024-03-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor FC BGA substrate Manufacturer, production characteristic: Ultra-small Bump Pitch, minimum mark 9um, minimum spacing 9um, minimum Blind & buried via holes 50UM, We have made 20 layers of FCBGA package substrates with high quality and fast lead time. In the continuous development of electronic packaging, semiconductor FC BGA substrates…

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Ceramic Package Substrate Manufacturer

2024-03-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ceramic package substrate Manufacturer, Ceramic substrate(PLATINE), 96AL2O3 Ceramic substrate(PLATINE), ALN Ceramic substrate(PLATINE) manufacture. we produce the Ceramic series materials PCB and package substrate from 1 Schicht zu 16 Schichten. Ceramic packaging substrate is a specialized substrate made of ceramic materials designed to provide reliable support and electrical connections to semiconductor…

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Semiconductor IC Substrate Manufacturer

2024-03-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor IC substrate Manufacturer, High TG, high speed or high frequency materials, low expansion and shrinkage coefficient materials, ultra-small marks, ultra-small spacing design. we produce this types IC/BGA substrates with high quality and fast lead time. Semiconductor IC substrates play a crucial role in modern electronic devices, serving as essential…

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BGA/IC Substrate Package Supplier

2024-03-04 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BGA/IC Substrate package Supplier, Ultra-small trace BGA substrate production supply, we have a professional team of engineers, professional BGA/IC substrate production equipment and Msap and Sap process. Substrate Package Manufacturer (SPM) specializes in the production of PCB Package Substrates, crucial components within the electronics industry for linking chips and PCB…

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Substrate & Packaging Manufacturer

2024-03-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Substrate & Packaging Manufacturer, We mainly produce various types of packaging substrates, ultra-small marks and gaps, at the same time, we also assemble packaging business. Substrat für Verpackungen, a fundamental element in contemporary electronic devices, serves as a foundational material for encapsulating and interconnecting electronic components. Typically crafted from insulating materials,…

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Organic Packaging Chip Substrates

2024-02-29 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Organic Packaging Chip Substrates Manufacturer, the Minimum trace/spacing are 9um/9um, Von 4 Schicht zu 20 layers ship substrates production. we use the BT, Showa Denko/Ajinomoto high-speed core materials or other kinds core materials to produce the Packaging Chip Substrates. Organic Packaging Chip Substrates are one of the crucial components in…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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