Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Mini Led PCB Manufacturing

2024-03-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Mini Led PCB Manufacturing, Ultra-small gap LED PCBs manufacture. We have made the LED pcb Pads to pads gap with 40um. 50um, 60um, some pads to pads gap are 80um. we can use the package substrates Msap and Sap production technology to produce the MINI led PCBs. we can do…

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Semiconductor Substrate Manufacturer

2024-03-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor substrate Manufacturer. High Frequency and High-speed substrates(Leiterplatten) provider , ultra-small trace width substrates manufacture, specializing in 2-50 layer high-quality substrates, including Semiconductor substrate. Semiconductor substrates play a vital role in today's electronic devices. It is a substrate that supports and connects various electronic components, such as chips, sensors, etc., providing…

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Ceramic Packaging Substrate Manufacturer

2024-03-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ceramic packaging substrate Manufacturer, Ceramic PCB and Ceramic packaging substrate production. 96AL2O3 Ceramic, ALN Ceramic and other types Ceramic series PCB and Ceramic package substrate provider. Ceramic Packaging Substrate is a basic material used to package integrated circuits (ICs) or other microelectronic devices. It is usually made of ceramic materials…

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Rigid-Flex Packaging Substrate Manufacturer

2024-03-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Rigid-Flex Packaging Substrate Manufacturer.A Rigid-Flex Packaging Substrate Manufacturer specializes in crafting innovative substrates for electronic devices, blending rigid and flexible materials seamlessly. With precision engineering and cutting-edge technology, they create durable yet adaptable substrates crucial for modern electronics. Their expertise lies in seamlessly integrating rigid and flexible components, ensuring reliability…

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Rigid-Flex BGA Substrate Manufacturer

2024-03-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Rigid-flex BGA substrate Manufacturer, the package substrates will be made with PI(flex) materials. and high-speed or high frequency materials. Make the BGA substrate more flexible. Rigid-flex BGA Substrate (rigid-flexible BGA substrate) is an advanced packaging substrate that combines the characteristics of rigid and flexible materials to provide unique design solutions…

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Semiconductor BGA Substrate Manufacturer

2024-03-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Semiconductor BGA substrate Manufacturer, the best small BGA Ball pitch 100um. the minimum Trace width are 9um, Der Mindestabstand beträgt 9 μm. the minimum via holes size are 50um. This is the minimum production data. please try to design the data as big as better. the price will be not…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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