Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Multi-Cavity PCB | RF PCB Manufacturing

2024-04-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Multi-Cavity PCB | RF PCB Manufacturing.Aluminum Nitride PCB Manufacturing involves the production of printed circuit boards (Leiterplatten) using aluminum nitride as the substrate material. This process is highly valued in industries requiring excellent thermal conductivity and electrical insulation. The resulting PCBs are ideal for high-power electronic devices, ensuring efficient heat…

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Extra Small Pitch PCB Manufacturing

2024-03-29 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Extra Small Pitch PCB Manufacturing.Extra Small Pitch PCB Manufacturing refers to the production process of printed circuit boards (Leiterplatten) with very fine spacing between the electrical conductors. This technique is crucial for modern electronics, allowing for the creation of highly compact and complex devices. Precision and advanced technology are essential…

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Aluminum Nitride PCB (AlN PCB) Manufacturing

2024-03-29 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Aluminum Nitride PCB (AlN PCB) Manufacturing.Aluminum Nitride PCB (AlN PCB) manufacturing involves the production of high-performance circuit boards using aluminum nitride as the substrate material. Known for its excellent thermal conductivity and electrical insulation properties, AlN is ideal for applications requiring efficient heat dissipation and high reliability. The manufacturing process…

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Mixed Dielectric Rogers PCB Manufacturing

2024-03-28 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Mixed Dielectric Rogers PCB Manufacturing.Mixed Dielectric Rogers PCB Manufacturing involves the production of printed circuit boards using various dielectric materials from Rogers Corporation. This process enhances performance by integrating materials with different dielectric constants, resulting in improved signal integrity, reduced loss, and better thermal management. Ideal for high-frequency applications, this…

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Cavity PCB Technology Manufacturing

2024-03-28 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Cavity PCB Technology Manufacturing.Cavity PCB Technology Manufacturing involves the creation of printed circuit boards with cavities or recesses that allow for the integration of various components at different heights. This advanced technique enhances performance by minimizing signal loss and optimizing thermal management, making it ideal for high-frequency and power electronics…

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Blind Vias&Buried Vias PCB Manufacturing

2024-03-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Blind Vias&Buried Vias PCB Manufacturing.Blind vias and buried vias are crucial elements in PCB manufacturing, enhancing circuit density and functionality. These specialized vias facilitate interconnection between layers of a printed circuit board without penetrating the entire board. Blind vias connect an outer layer to one or more inner layers, while…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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