Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Ultra-small Size Package Substrates Manufacturer

2024-05-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra-small Size Package Substrates Manufacturer.An Ultra-small Size Package Substrates Manufacturer specializes in producing highly compact substrates essential for advanced electronics. These miniature substrates enable the development of cutting-edge devices, enhancing performance and efficiency while reducing overall size. The manufacturer's expertise lies in precision engineering and innovative technology, ensuring that their…

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ABF GXT31R2 Package Substrates Manufacturer

2024-05-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

ABF GXT31R2 Package Substrates Manufacturer.ABF GXT31R2 Package Substrates Manufacturer is a leading producer of advanced semiconductor packaging solutions. Specializing in the ABF (Ajinomoto Build-up Film) GXT31R2 series, this manufacturer delivers high-performance substrates essential for modern electronic devices, ensuring enhanced connectivity, reliability, and efficiency. Their cutting-edge technology and stringent quality standards…

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Ultrathin BGA Substrates Manufacturer

2024-05-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin BGA Substrates Manufacturer.Ultrathin BGA Substrates Manufacturer specializes in producing cutting-edge, ultra-thin ball grid array (BGA) substrates used in advanced electronic devices. Our innovative technology ensures exceptional precision and reliability, catering to the high demands of modern semiconductor applications. We prioritize quality and performance, making us a trusted partner for…

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Ultra High Density Wiring Substrates Manufacturer

2024-05-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra High Density Wiring Substrates Manufacturer.An Ultra High Density Wiring Substrates Manufacturer specializes in producing advanced circuit boards with exceptionally dense wiring. These substrates are crucial for high-performance electronic devices, enabling faster data transmission, improved miniaturization, and enhanced reliability. The manufacturer employs cutting-edge technology and precision engineering to meet the…

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Microtrace RF Substrates Manufacturer

2024-05-10 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microtrace RF Substrates Manufacturer.Microtrace RF Substrates Manufacturer specializes in producing advanced substrates for RF (radio frequency) applications. Utilizing cutting-edge technology and materials, the company ensures high performance and reliability in demanding environments. Their products are essential for telecommunications, defense, and aerospace industries, providing precise and efficient solutions to enhance signal…

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Radio Frequency PCB Manufacturer

2024-05-09 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Radio Frequency PCB Manufacturer.A Radio Frequency PCB Manufacturer specializes in designing and producing printed circuit boards (Leiterplatten) tailored for radio frequency (RF) applications. These manufacturers ensure that PCBs can handle high-frequency signals with minimal interference and signal loss, crucial for devices like wireless communications, radar systems, and satellite technology. They…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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