Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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Glass Materials Package Substrates Manufacturer

2024-05-25 Company News / News / Notification / Trade News

Glass Materials Package Substrates Manufacturer.Ajinomoto GX92 Package Substrate Manufacturer is a leading company specializing in advanced electronic packaging materials. Known for its innovative Ajinomoto Build-up Film (ABF) substrates, the company excels in producing high-performance materials essential for semiconductor packaging. Their GX92 substrates are designed to meet the demands of next-generation…

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Multi-Chip FC-BGA Substrates Manufacturer

2024-05-24 Company News / News / Notification / Trade News

Multi-Chip FC-BGA Substrates Manufacturer.A Multi-Chip FC-BGA Substrates Manufacturer specializes in designing and producing advanced flip-chip ball grid array (FC-BGA) substrates that support multiple semiconductor chips. These substrates are critical in high-performance computing and consumer electronics, offering superior electrical performance, thermal management, and miniaturization. The manufacturer ensures precision engineering, reliability, and…

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ABF GZ41R2H Package Substrates Manufacturer

2024-05-23 Company News / News / Notification / Trade News

ABF GZ41R2H Package Substrates Manufacturer.ABF GZ41R2H Package Substrates Manufacturer specializes in crafting advanced package substrates, catering to the intricate needs of cutting-edge electronic devices. With a commitment to innovation and precision engineering, they deliver substrates of unparalleled quality, crucial for ensuring the reliability and performance of semiconductor packages. Leveraging state-of-the-art…

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Minimum Clearance PCB Manufacturer

2024-05-22 Company News / News / Notification / Trade News

Minimum Clearance PCB Manufacturer.A Minimum Clearance PCB Manufacturer specializes in crafting circuit boards with precise spacing between components, ensuring optimal performance and reliability in tight spaces. Employing advanced manufacturing techniques, they meticulously engineer boards with minimal separation between conductive elements, enabling efficient electronic signal transmission while conserving valuable real estate…

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Ultrathin FC-LGA Substrates Manufacturer

2024-05-21 Company News / News / Notification / Trade News

Ultrathin FC-LGA Substrates Manufacturer.A leading manufacturer specializing in ultrathin FC-LGA substrates, we pioneer precision engineering in electronics. Our substrates redefine miniaturization, enabling sleeker designs without compromising performance. Employing cutting-edge fabrication techniques, we produce substrates with unparalleled thinness and reliability. Our commitment to innovation ensures compatibility with the latest technologies, empowering…

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Ultrathin BGA Package Substrates Manufacturer

2024-05-20 Company News / News / Notification / Trade News

Ultrathin BGA Package Substrates Manufacturer.The Ultrathin BGA Package Substrates Manufacturer specializes in crafting cutting-edge substrates for Ball Grid Array (BGA) packaging solutions. With precision engineering and advanced materials, they fabricate ultra-thin substrates that optimize space utilization while ensuring robust performance. Their expertise lies in creating substrates that meet stringent industry…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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market@alcantapcb.com

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