Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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AI Accelerator Module PCB Manufacturer

2024-06-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

AI Accelerator Module PCB Manufacturer.An AI Accelerator Module PCB Manufacturer is a specialized company dedicated to crafting printed circuit boards (Leiterplatten) tailored for AI accelerator modules. These modules serve as the backbone of artificial intelligence systems, enhancing computational speed and efficiency. With meticulous craftsmanship and cutting-edge technology, these manufacturers design…

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Manufacturer of The CPU Package Substrates

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Manufacturer of The CPU Package Substrates.The manufacturer specializes in crafting intricate CPU package substrates, finely engineered to meet the demands of cutting-edge technology. Their production line hums with precision as skilled hands meticulously assemble each component, ensuring optimal performance and reliability. From intricate circuitry to durable materials, every substrate embodies…

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Ultra-Small Size FC-LGA Substrates Manufacturer

2024-05-30 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra-Small Size FC-LGA Substrates Manufacturer.Established as a pioneer in technological miniaturization, our company specializes in crafting Ultra-Small Size FC-LGA Substrates. We're not merely manufacturers; we're architects of precision, sculpting substrates that redefine compactness while maintaining uncompromised performance standards. Leveraging cutting-edge fabrication techniques and stringent quality controls, we engineer substrates that…

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Micro PCB Substrate Manufacturer

2024-05-28 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Micro PCB Substrate Manufacturer.A Micro PCB Substrate Manufacturer specializes in crafting intricate circuitry foundations on a miniature scale. Employing cutting-edge technologies and precision engineering, they produce substrates tailored to the demands of modern electronics. These substrates serve as the backbone for microelectronic devices, ensuring optimal performance in compact designs. With…

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Ultra-Small Size BGA/IC Substrates Manufacturer

2024-05-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra-small Size BGA/IC Substrates Manufacturer.NanoTech Electronics is a leading Ultra-small Size BGA/IC Substrates Manufacturer, specializing in high-precision, miniaturized solutions for the semiconductor industry. Our advanced manufacturing techniques and cutting-edge technology ensure superior performance and reliability, catering to the evolving demands of modern electronics. Partner with NanoTech Electronics for innovative and…

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CPU Ball Package Substrates Manufacturer

2024-05-26 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CPU Ball Package Substrates Manufacturer.A CPU Ball Package Substrates Manufacturer specializes in producing high-quality substrates for CPU ball grid array (BGA) packaging. These substrates serve as critical components, providing mechanical support and electrical connections between the CPU and the motherboard. By utilizing advanced materials and precise manufacturing processes, they ensure…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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