Professioneller Hersteller von Verpackungssubstraten und ultrakleinen Leiterbahnen mit HDI-Leiterplatten.

+086 0755 8524 1496 : market@alcantapcb.com |

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Flip Chip BGA Substrate Manufacturer

2024-06-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip BGA Substrate Manufacturer.As a Flip Chip BGA Substrate Manufacturer, we specialize in crafting advanced interconnection solutions for semiconductor devices. Our expertise lies in designing and producing high-quality substrates that enable efficient mounting and connection of integrated circuits onto PCBs. With a focus on innovation and precision engineering, we…

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Ultra-Multilayer BGA Substrates Manufacturer

2024-06-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra-Multilayer BGA Substrates Manufacturer.As an advanced manufacturer specializing in ultra-multilayer BGA substrates, we lead the industry in crafting high-density interconnection solutions. Our expertise ensures superior performance and reliability in electronic assemblies, meeting the demands of cutting-edge technology applications. With the rapid development of electronic equipment and the increase in functional…

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RT Duroid 5880 Substrate Manufacturer

2024-06-05 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

RT Duroid 5880 Substrate Manufacturer.RT Duroid 5880 Substrate Manufacturer specializes in producing high-frequency laminates designed for microwave and RF applications. Known for its low dielectric constant and minimal signal loss, RT Duroid 5880 is ideal for aerospace, defense, and communication systems. Our advanced manufacturing ensures high-quality, reliable substrates tailored to…

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Microtrace Antenna Circuit Board Manufacturer

2024-06-04 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microtrace Antenna Circuit Board Manufacturer.Microtrace Antenna Circuit Board Manufacturer specializes in crafting intricate antenna circuit boards, designed with precision and expertise to meet the demands of modern technology. With a commitment to excellence, they employ cutting-edge techniques to ensure optimal performance and reliability in every product. Their team of skilled…

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IPC Class III Boards Manufacturer

2024-06-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

IPC Class III Boards Manufacturer.An IPC Class III Boards Manufacturer specializes in producing circuit boards built to the highest industry standards, ensuring durability and reliability in the most demanding environments. With meticulous attention to detail, cutting-edge technology, and rigorous quality control measures, they craft boards capable of withstanding extreme conditions,…

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Ultra-Multilayer FC-BGA Substrates Manufacturer

2024-06-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultra-Multilayer FC-BGA Substrates Manufacturer.An industry-leading manufacturer specializing in Ultra-Multilayer FC-BGA Substrates, our company employs cutting-edge technology and stringent quality control measures to deliver exceptional products. With a focus on innovation and reliability, we craft substrates that meet the highest standards of performance and durability. Our state-of-the-art facilities and experienced team…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 An 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 Monate

+086 0755 85241496

market@alcantapcb.com

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