Professional manufacturer of packaging substrates and ultra-small trace HDI PCBs.

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Cavity PCB | High Frequency PCB Manufacturing

2024-03-27 Company News / News / Notification / Trade News

Cavity PCB | High Frequency PCB Manufacturing."Cavity PCBs are meticulously crafted, embodying precision and efficiency in high-frequency PCB manufacturing. These specialized boards feature cavities, meticulously engineered to house sensitive components, ensuring optimal signal integrity and reduced electromagnetic interference. High-frequency PCB manufacturing employs advanced techniques, meticulously controlling impedance and minimizing signal…

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Rogers Cavity PCB Manufacturing

2024-03-26 Company News / News / Notification / Trade News

Rogers Cavity PCB Manufacturing.Rogers Cavity PCB Manufacturing specializes in crafting intricate printed circuit boards (PCBs) with precision and reliability. With advanced technology and a skilled team, they engineer PCBs featuring cavity structures, ideal for compact electronic devices requiring superior performance. Rogers' proprietary manufacturing process ensures optimal signal integrity and thermal…

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Ceramic PCB Substrates Manufacturing

2024-03-26 Company News / News / Notification / Trade News

Ceramic PCB Substrates Manufacturing.Ceramic PCB substrates manufacturing involves intricate processes melding cutting-edge technology with precision craftsmanship. It begins with meticulously selecting high-grade ceramic materials, followed by intricate shaping and layering techniques to form the base substrate. Advanced printing methods then intricately etch conductive pathways onto the surface, enabling seamless electronic…

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Cross Blind/Buried Vias PCB Manufacturing

2024-03-26 Company News / News / Notification / Trade News

Cross Blind/Buried Vias PCB Manufacturing.Cross blind/buried vias PCB manufacturing involves the intricate process of creating circuit boards with vias that connect multiple layers while remaining hidden from view. This advanced technique requires precise drilling and plating methods, ensuring optimal conductivity and reliability. Through careful design and fabrication, these vias enable…

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Mini Ceramics PCB Manufacturing

2024-03-25 Company News / News / Notification / Trade News

Mini Ceramics PCB Manufacturing.Cross blind/buried vias PCB manufacturing involves the intricate process of creating circuit boards with vias that connect multiple layers while remaining hidden from view. This advanced technique requires precise drilling and plating methods, ensuring optimal conductivity and reliability. Through careful design and fabrication, these vias enable complex…

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3D Ceramic Packages Substrate Manufacturing

2024-03-25 Company News / News / Notification / Trade News

3D Ceramic Packages Substrate Manufacturing.3D Ceramic Packages Substrate Manufacturing is a cutting-edge process revolutionizing electronics production. This innovative technique crafts intricate ceramic substrates for electronic components, employing advanced three-dimensional printing technologies. By layering ceramic materials with precision, it enables the creation of complex structures, enhancing thermal management and electrical performance.…

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Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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market@alcantapcb.com

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